Intel® Compute Stick STK1AW32SC STK1A32SC Technical Product Specification June 2016 Order Number: H91231-007
Revision History Revision Revision History Date 001 First release November 2015 002 Changed URL for BIOS Update and BIOS Recovery information January 2016 003 Corrected MTBF number January 2016 004 Added Section 2.3 Mechanical Considerations and updated Section 2.4 Reliability February 2016 005 Corrected the headers March 2016 006 Updated Section 1.
Preface This Technical Product Specification (TPS) specifies the layout, components, connectors, power and environmental requirements, and the BIOS for Intel Compute Stick STK1AW32SC and STK1A32SC. NOTE In this document, the use of “Intel Compute Stick” will refer to the STK1AW32SC and STK1A32SC versions of the Intel Compute Stick.
Intel Compute Stick STCK1AW32SC and STCK1A32SC Technical Product Specification Other Common Notation iv # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kb Kilobit (1024 bits) kb/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mb Megabit (1,048,576 bits) Mb/s Megabits per second TDP Thermal Design Power Xxh An add
Contents Revision History Errata............................................................................................................................................................................ ii Preface Intended Audience................................................................................................................................................ iii What This Document Contains .....................................................................................................
Intel Compute Stick STCK1AW32SC and STCK1A32SC Technical Product Specification 2.4 2.5 Reliability ..................................................................................................................................................... 22 Environmental ........................................................................................................................................... 23 3 Overview of BIOS Features 3.1 3.2 3.3 3.4 3.5 3.6 3.7 Introduction .............................
1 Product Description 1.1 Overview 1.1.1 Version Summary There are two different versions of this model of Intel® Compute Stick available which are summarized in Table 1. Unless otherwise noted in this document all features are available on all versions of the Intel Compute Stick. Table 1. Version Summary Version Processor OS Pre-installed STK1AW32SC Intel® Atom™ x5-Z8300 or x5-Z8330 Yes, Windows 10* STK1A32SC Intel® Atom™ x5-Z8300 or x5-Z8330 No 1.1.
Intel Compute Stick STCK1AW32SC and STCK1A32SC Technical Product Specification 1.1.3 Location of Components Figures 1 and 2 show the location of the components on the Intel Compute Stick. Item Description A HDMI Connector B Power LED C Security Loop D Micro SD Card Reader Slot Figure 1. Left-Side View of Intel Compute Stick Item Description A USB 3.0 Connector B USB 2.0 Connector C 5 V DC Connector D Power On/Off Button Figure 2.
Product Description 1.1.4 Block Diagram Figure 3 is a block diagram of the major functional areas of the Intel Compute Stick. Figure 3.
Intel Compute Stick STCK1AW32SC and STCK1A32SC Technical Product Specification 1.2 Online Support To find information about… Visit this World Wide Web site: Intel Compute Stick http://www.intel.com/computesticksupport 1.3 Operating System Overview The Intel Compute Stick STK1AW32SC has Windows 10 Home 32-bit pre-installed with all necessary drivers. The Intel Compute Stick STK1A32SC supports the following Operating Systems (32-bit or 64-bit).
Product Description 1.4 Processor The Intel Compute Stick has a soldered-down System-on-a-Chip (SoC), which consists of an Intel Atom Processor x5-Z8300 or x5-Z8330. • • • 1.5 Integrated Intel® HD Graphics Integrated memory controller Integrated PCH System Memory The Intel Compute Stick has soldered-down memory and supports the following memory features: • • • DDR3L-RS 1600 MHz Single-channel memory 2 GB total memory Refer to Section 2.1.
Intel Compute Stick STCK1AW32SC and STCK1A32SC Technical Product Specification 1.7.1.2 Video Memory Allocation Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system memory for use as graphics memory to balance 2D/3D graphics and system performance. If your computer is configured to use DVMT, graphics memory is allocated based on system requirements and application demands (up to the configured maximum amount).
Product Description 1.9 Wireless LAN Subsystem The wireless LAN subsystem consists of the following: • • Intel® Dual Band Wireless-AC 7265 module 1216 BGA soldered-down For information about Refer to LAN software and drivers http://downloadcenter.intel.com 1.9.1 Wireless Network Module The Dual Band Wireless-AC module provides hi-speed wireless connectivity with the following capabilities: • • • • 802.11a/b/g/n, 802.11ac 2.4 GHz, 5 GHz Two antennas Dual-mode Bluetooth 4.
Intel Compute Stick STCK1AW32SC and STCK1A32SC Technical Product Specification 1.11.1 ACPI ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with the Intel Compute Stick requires an operating system that provides full ACPI support.
Product Description 1.11.1.2 Wake-up Devices and Events Table 5 lists the devices or specific events that can wake the Intel Compute Stick from specific states. Table 5. Wake-up Devices and Events Devices/events that wake up the system… …from this sleep state Power switch S5 RTC alarm N/A Wake from RTC is not supported Wireless LAN N/A Wake from Wireless LAN is not supported USB N/A Wake from USB is not supported Bluetooth N/A Wake from Bluetooth is not supported 1.11.
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2 Technical Reference 2.1 Memory Resources 2.1.1 Addressable Memory The Intel Compute Stick utilizes up to 2 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory).
Intel Compute Stick STCK1AW32SC and STCK1A32SC Technical Product Specification 2.2 Connectors This section describes the connectors available on the Intel Compute Stick. 2.2.1 USB 3.0 Connector The Intel Compute Stick has a single full size USB 3.0 connector that supports compliant USB devices. Bootable USB devices are supported. Figure 4. USB 3.0 Connector 2.2.2 USB 2.0 Connector The Intel Compute Stick has a single full size USB 2.0 connector that supports compliant USB devices.
Technical Reference 2.2.3 Micro SD Card Reader The Intel Compute Stick has a microSecure Digital (SD) card reader that supports the Secure Digital eXtended Capacity (SDXC) format. Micro SD card 8 GB, 16 GB, 32 GB, 64 GB and 128 GB sizes are supported. Figure 6. Micro SD Card Reader 2.2.4 Power Adapter Connector The Intel Compute Stick is powered through a 5V DC connector on the side. The maximum current rating is 3A. Figure 7.
Intel Compute Stick STCK1AW32SC and STCK1A32SC Technical Product Specification 2.2.5 Power Adapter The Intel Compute Stick uses a 5V 3A AC to DC power adapter. The power adapter is connected to the Intel Compute Stick via a six foot cable with a USB Type B connector. Item Description A 5V 3A Connector Figure 8. Power Adapter NOTE The supplied power adapter with attached cable is required to power the Intel Compute Stick.
Technical Reference Use of a wire rope type cable that is >3mm can be used with crimps to secure the Compute Stick. One example is shown below. However, many different options are available via 3rd party suppliers. Figure 10.
Intel Compute Stick STCK1AW32SC and STCK1A32SC Technical Product Specification 2.3 Mechanical Considerations 2.3.1 Form Factor Figure 11 illustrates the mechanical form factor for the Intel Compute Stick. Dimensions are given in millimeters. Figure 11. Intel Compute Stick Dimensions Table 6. Intel Compute Stick Weight Information 2.4 Item Weight Compute Stick only 60.0g Compute Stick in package 253.
Technical Reference 2.5 Environmental Table 7 lists the environmental specifications for the Intel Compute Stick. Table 7. Environmental Specifications Parameter Specification Temperature Non-Operating -40 °C to +60 °C Operating 0 °C to +35 °C The operating temperature of the Intel Compute Stick may be determined by measuring the air temperature from the outside of the chassis while the system is in operation1.
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3 Overview of BIOS Features 3.1 Introduction The Intel Compute Stick uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, and Plug and Play support. The initial production BIOSs are identified as SCCHTAX5.86A. The BIOS Setup program can be used to view and change the BIOS settings for the computer, and to update the system BIOS.
Intel Compute Stick STCK1AW32SC and STCK1A32SC Technical Product Specification 3.4 BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: • • Intel Express BIOS Update Utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from the file location on the Web.
Regulatory Compliance and Battery Disposal Information For information about Refer to BIOS recovery http://www.intel.com/content/www/us/en/support/boards-and-kits/intelcompute-stick/000005902.html 3.6 Boot Options In the BIOS Setup program, the user can choose to boot from local storage or a removable drive. The default setting is for the local storage to be the first boot device. 3.6.1 Booting Without Attached Devices.
Intel Compute Stick STCK1AW32SC and STCK1A32SC Technical Product Specification 3.6.4 Power Button Menu The Power Button Menu is accessible via the following sequence: 1. System is in S5 (not G3) 2. User pushes the power button and holds it down for approximately 3 seconds 3. Release immediately 4. User releases the power button before the 4-second shutdown override If this boot path is taken, the BIOS will use default settings, ignoring settings in VPD where possible.
