Specification Sheet

Intel NUC Kit Features
49
Table 31. Thermal Considerations for Components provides maximum case temperatures for the
components that are sensitive to thermal changes. The operating temperature, current load, or
operating frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 31. Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and processor
specification updates
To ensure functionality and reliability, the component is specified for proper operation when
Case Temperature is maintained at or below the maximum temperature listed in Table 30. This is
a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified
as the maximum sustainable power to be dissipated by the components). When the component is
dissipating less than TDP, the case temperature should be below the Maximum Case
Temperature. The surface temperature at the geometric center of the component corresponds to
Case Temperature.
It is important to note that the temperature measurement in the system BIOS is a value reported
by embedded thermal sensors in the components and does not directly correspond to the
Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is
Tcontrol.
Table 32. Tcontrol Values for Components
Component
Tcontrol
Processor For processor case temperature, see processor datasheets and processor
specification updates
For information about
Refer to
Processor datasheets and specification updates
Section 1.2, page 7