Specification Sheet

ManualsBrandsIntel ManualsComputers & AccessoriesIntel NUC 6 Essential Kit (NUC6CAYH) - Celeron, Tall, Add't Components Needed

Intel® NUC Board NUC6CAYB

Technical Product Specification

Regulatory Model: NUC6CAY

September 2017

Order Number: J46865-002

The Intel NUC Board NUC6CAYB may contain design defects or errors known as errata that may cause the product to deviate from published

specifications. Current characterized errata are documented in the Intel NUC Board NUC6CAYB Specification Update.

Summary of content (66 pages)

PAGE 1
Intel® NUC Board NUC6CAYB Technical Product Specification Regulatory Model: NUC6CAY September 2017 Order Number: J46865-002 The Intel NUC Board NUC6CAYB may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel NUC Board NUC6CAYB Specification Update.
PAGE 2
Revision History Revision Revision History 001 First release of Intel NUC Board NUC6CAYB Technical Product Specification Date November 2016 002 Spec Change September 2017 Disclaimer This product specification applies to only the standard Intel® NUC Board and Kits with BIOS identifier AYAPLCEL.86A. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
PAGE 3
Board Identification Information Basic Intel® NUC Board NUC6CAYB Identification Information AA Revision BIOS Revision Notes J23203-402 AYAPLCEL.86A.0026 1,2 J26842-402 AYAPLCEL.86A.0026 1,2,3 Notes: 1. The AA number is found on a small label on the SO-DIMM memory connector. 2. Intel® Celeron® processor J3455, used on this AA revision, consists of the following component: Device Stepping S-Spec Number(s) Intel Celeron processor J3455 B1 SR2Z9 3.
PAGE 4
Intel NUC Board NUC6CAYB Technical Product Specification Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel® NUC Board NUC6CAYB. This board may be found in Intel® NUC Kit NUC6CAYH (without memory and operating system) and Intel® NUC Kit NUC6CAYS (with pre-installed SO-DIMM memory and operating system).
PAGE 5
Other Common Notation # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kb Kilobit (1024 bits) kb/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mb Megabit (1,048,576 bits) Mb/s Megabits per second TDP Thermal Design Power xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.
PAGE 6
PAGE 7
Contents Revision History ............................................................................................................... ii Board Identification Information..................................................................................................................... iii Product Identification Information................................................................................................................. iii Errata...........................................................
PAGE 8
1.12.1 Hardware Monitoring ........................................................................................................... 28 1.12.2 Fan Monitoring........................................................................................................................ 28 1.12.3 Thermal Solution ................................................................................................................... 29 1.13 Power Management ................................................................
PAGE 9
Contents 4 Error Messages and Blink Codes ......................................................................... 64 4.1 4.2 Front-panel Power LED Blink Codes ................................................................................................ 64 BIOS Error Messages............................................................................................................................... 64 5 Intel NUC Kit Features .........................................................................
PAGE 10
Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. x Connectors and Headers Shown in Figure 13 ........................................................................... 41 VGA Header ....................................................................................................................
PAGE 11
1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor 4.0 inches by 4.0 inches (101.60 millimeters by 101.
PAGE 12
Table 1. Feature Summary (continued) Expansion Capabilities One M.2 Module supporting M.
PAGE 13
Product Description 1.1.2 Board Layout (Top) Figure 1 shows the location of the major components on the top-side of Intel NUC Board NUC6CAYB. Figure 1.
PAGE 14
Table 2 lists the components identified in Figure 1. Table 2.
PAGE 15
Product Description 1.1.3 Board Layout (Bottom) Figure 2 shows the location of the major components on the bottom-side of Intel NUC Board NUC6CAYB. Figure 2.
PAGE 16
Table 3. Components Shown in Figure 2 16 Item from Figure 2 Description A Back panel connectors B Front panel HDD LED ring connector (HDD_LED) (1.25 mm pitch) C Digital microphone array (DMICS) connector (1.25 mm pitch) D VGA header (2.0 mm pitch) E Auxiliary power connector (AUX_PWR) (1.25 mm pitch) F M.2 2230 Module socket (with Intel® Dual Band Wireless-AC 3168 card installed) G BIOS security jumper H SDXC slot I, J Front panel single-port USB 2.0 connector (1.
PAGE 17
Product Description 1.1.4 Block Diagram Figure 3 is a block diagram of the major functional areas of the board. Figure 3.
PAGE 18
1.2 Online Support 1.3 To find information about… Visit this World Wide Web site: Intel NUC Board NUC6CAYB http://www.intel.com/NUC NUC Board Support http://www.intel.com/NUCSupport Available configurations for Intel NUC Board NUC6CAYB http://ark.intel.com BIOS and driver updates http://downloadcenter.intel.com Tested memory http://www.intel.com/NUCSupport Integration information http://www.intel.
PAGE 19
Product Description 1.4 System Memory The board has two 204-pin SO-DIMM sockets and supports the following memory features: • • • • • • • 1.35 V DDR3L 1600/1866 MHz SDRAM non-ECC SO-DIMM with gold plated contacts on Intel Celeron processor J3455 Two memory channels Unbuffered, single-sided or double-sided SO-DIMMs using 4 Gb or 8 Gb technology (density) 8 GB maximum total system memory (with 4 Gb or 8 Gb memory technology). Refer to Section 2.1.
PAGE 20
Figure 4 illustrates the memory channel and SO-DIMM configuration. Figure 4. Memory Channel and SO-DIMM Configuration For information about… Tested Memory 20 Refer to: http://www.intel.
PAGE 21
Product Description 1.5 Processor Graphics Subsystem The board supports HDMI and VGA integrated graphics via the processor. 1.5.1 Intel® High Definition (Intel® HD) Graphics The Intel HD graphics controller features the following: • • • • • • HDMI 2.0 through a MegaChips MCDP2800-BCT DisplayPort 1.2a to HDMI 2.0 Level Shifter/Protocol Converter (LSPCON) 3D graphics hardware acceleration supporting DirectX* 9.3/10/11.1/12, OpenCL* 1.2, OGL ES 3.0, OpenGL* 4.
PAGE 22
1.6 USB The USB port arrangement is as follows: • USB 3.0 ports:  Two ports are implemented with external front panel connectors (one blue and one amber charging capable)  Two ports are implemented with external back panel connectors (blue) •  Maximum current is 900 mA for each blue port, 1.5 A for the amber charging port USB 2.0 ports:  Two ports via two single-port internal 1x4 1.25 mm pitch headers (white)  One port is reserved for an M.
PAGE 23
Product Description 1.8 Embedded MultiMediaCard (e-MMC) - optional The board contains a 32 GB Embedded MultiMediaCard (e·MMC) onboard storage module with Windows 10 Home operating system preinstalled (e-MMC and OS included in Intel NUC Kit NUC6CAYS only). 1.9 Real-Time Clock Subsystem A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years.
PAGE 24
1.10 Audio Subsystem The board supports Intel HD Audio via the Realtek ALC283 audio codec. The audio subsystem supports the following features: • • • • • • Analog line-out/Analog Headphone/Analog Microphone jack on the front panel High Definition Audio via a stereo microphone/headphone/optical jack on the back panel Support for 44.1 kHz/48 kHz/96 kHz sample rates on all analog outputs Support for 44.
PAGE 25
Product Description 1.10.2 Mini-TOSLINK Interface The 3.5 mm audio jack also provides TOSLINK optical digital audio output. Mini-TOSLINK interface (back panel) plus analog audio out  PCM datastream support •  S/PDIF datastream support  Mini-TOSLINK adaptor (not included) necessary to connect to standard TOSLINK cable  Stereo audio out Figure 6. Mini-TOSLINK Adaptor (not included) 1.10.3 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site.
PAGE 26
1.
PAGE 27
Product Description 1.11.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 7). Item Description A Link LED (Green) B Data Rate LED (Green/Yellow) Figure 7. LAN Connector LED Locations Table 6 describes the LED states when the board is powered up and the LAN subsystem is operating. Table 6. LAN Connector LED States LED LED Color Link (A) Green Data Rate (B) 1.11.4 Green/Yellow LED State Condition Off LAN link is not established.
PAGE 28
1.12 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including thermal and voltage monitoring. For information about Refer to Wired for Management (WfM) Specification www.intel.com/design/archives/wfm/ 1.12.
PAGE 29
Product Description 1.12.3 Thermal Solution Figure 8 shows the location of the thermal solution and processor fan header. Item Description A Processor fan header B Thermal solution Figure 8.
PAGE 30
1.13 Power Management Power management is implemented at several levels, including: Software support through Advanced Configuration and Power Interface (ACPI) Hardware support:  Power Input  Instantly Available PC technology  LAN wake capabilities  Wake from USB  WAKE# signal wake-up support  Wake from S5  Wake from CIR  +5 V Standby Power Indicator LED • • 1.13.1 ACPI ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer.
PAGE 31
Product Description 1.13.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.
PAGE 32
1.13.1.2 Wake-up Devices and Events Table 9 lists the devices or specific events that can wake the computer from specific states. Table 9.
PAGE 33
Product Description 1.13.2.1 Power Input When resuming from an AC power failure, the computer may return to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu. 1.13.2.2 Instantly Available PC Technology Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-RAM) sleep-state.
PAGE 34
CAUTION If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices. Figure 9. Location of the Standby Power LED 1.13.
PAGE 35
Product Description Table 10. HDMI CEC expected behavior Activity Current Status PC1,2 TV3 Action Expected Behavior Wake On TV Off Off TV on PC on Standby by TV On On TV Standby PC sleep or power off4 Auto Turn Off TV (S0 -> S5) On On PC Shutdown TV standby3 Auto Turn On TV (S5 -> S0) Off Off PC On TV on3 Auto Turn Off TV (S0 -> S3) On On PC Sleep TV standby3 Auto Turn On TV (S3 -> S0) Off Off PC On TV on3 Notes: 1.
PAGE 36
1.14 Intel Platform Security Technologies Intel platform security technologies provides tools and resources to help the user protect their information by creating a safer computing environment. NOTE Software with security capability is required to take advantage of Intel platform security technologies. 1.14.
PAGE 37
2 Technical Reference 2.1 Memory Resources 2.1.1 Addressable Memory The board utilizes up to 8 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory).
PAGE 38
2.2.1 Front Panel Connectors Figure 10 shows the location of the front panel connectors, controls and indicators for the board. Item Description A Power switch and LED B Front panel stereo microphone/headphone jack C USB 3.0 port (blue) D USB 3.0 charging-capable port (amber) E CIR Figure 10. Front Panel Connectors, Controls and Indicators 2.2.2 Back Panel Connectors Figure 11 shows the location of the back panel connectors for the board.
PAGE 39
Technical Reference 2.2.3 Headers and Connectors (Top) Figure 12 shows the location of the headers and connectors on the top-side of the board. Figure 12. Headers and Connectors (Top) Table 11 lists the headers and connectors identified in Figure 12. Table 11.
PAGE 40
2.2.4 Connectors and Headers (Bottom) Figure 13 shows the locations of the connectors and headers on the bottom-side of the board. Figure 13.
PAGE 41
Technical Reference Table 12 lists the connectors and headers identified in Figure 13. Table 12. Connectors and Headers Shown in Figure 13 Item from Figure 13 Description A Front panel HDD LED ring connector (HDD_LED) B Digital microphone array connector (DMICS) C VGA header D Auxiliary power connector (AUX_PWR) (1.25 mm pitch) E M.2 2230 Module connector F BIOS security jumper G SDXC slot H, I Front panel single-port USB 2.0 header (1.25 mm pitch) J SATA 6.
PAGE 42
2.2.4.1 Signal Tables for the Connectors and Headers Table 13. VGA Header Pin Signal Name Pin Signal Name 1 CLK 2 DATA 3 VCC 4 VSYNC 5 HSYNC 6 GND 7 RED 8 GND 9 GREEN 10 GND 11 BLUE 12 KEY Table 14. SATA Power Header (1.25 mm Pitch) Pin Signal Name 1 5V 2 5V 3 3.3 V 4 GND 5 GND NOTE Connector is Molex* part number 53398-0571, 1.25 mm pitch PicoBlade* header, surface mount, vertical, lead-free, 5 circuits. Table 15. Single-Port Internal USB 2.0 Headers (1.
PAGE 43
Technical Reference Table 16. Digital Microphone (DMICS) Array Connector (1.25 mm Pitch) Pin Signal Name 1 Ground 2 +3.3 V DC (+3V3_DMIC) 3 Clock (DMIC_CLK) 4 Data (DMIC_DAT) NOTE Connector is Molex part number 53398-0571, 1.25 mm pitch PicoBlade header, surface mount, vertical, lead-free, 4 circuits. Table 17. Front Panel HDD LED Ring Connector (1.25 mm Pitch) Pin Signal Name 1 +3.3VSB 2 Red HDD LED 3 Green HDD LED 4 Blue HDD LED NOTE Connector is Molex part number 53398-0571, 1.
PAGE 44
66 RESERVED 67 RESERVED 64 RESERVED 65 RESERVED 62 ALERT# (I)(0/3.3) 63 GND 60 I2C CLK (O)(0/3.3) 61 RESERVED 58 I2C DATA (I/O)(0/3.3) 59 RESERVED 56 W_DISABLE1# (O)(0/3.3V) 57 GND 54 W_DISABLE2# (O)(0/3.3V) 55 PEWAKE0# (I/O)(0/3.3V) 52 PERST0# (O)(0/3.3V) 53 CLKREQ0# (I/O)(0/3.3V) 50 SUSCLK(32kHz) (O)(0/3.
PAGE 45
Technical Reference 2.2.4.2 Add-in Card Connector The board supports a M.2 2230 (key type E) module. Supports M.2 wireless communication module Intel® Dual Band Wireless-AC 3168 module pre-installed • • 2.2.4.3 SDXC Card Reader The board has a standard Secure Digital (SD) card reader that supports the Secure Digital eXtended Capacity (SDXC) format, 3.01 specification. Table 20.
PAGE 46
2.2.4.4 Power Supply Connector The board has the following power supply connector: External Power Supply – the board is powered through a 12-19 V DC connector on the back panel. The back panel DC connector is compatible with a 5.5 mm/OD (outer diameter) and 2.5 mm/ID (inner diameter) plug, where the inner contact is +19 (±10%) V DC and the shell is GND. The maximum current rating is 3 A. • NOTE External power voltage, 12-19 V DC, is dependent on the type of power adapter used. Table 21.
PAGE 47
Technical Reference 2.2.4.5 Front Panel Header (2.0 mm Pitch) This section describes the functions of the front panel header. Table 22 lists the signal names of the front panel header. Figure 14 is a connection diagram for the front panel header. Table 22. Front Panel Header (2.
PAGE 48
2.2.4.5.3 Power/Sleep LED Header Pins 2 and 4 can be connected to a one- or two-color LED. Table 23 and Table 24 show the possible LED states. Table 23. States for a One-Color Power LED LED State Description Off Power off Blinking Standby Steady Normal operation Table 24.
PAGE 49
Technical Reference 2.2.4.6 Consumer Infrared (CIR) Sensor The Consumer Infrared (CIR) sensor on the front panel provides features that are designed to comply with Microsoft Consumer Infrared usage models. The CIR feature is made up of the receiving sensor. The receiving sensor consists of a filtered translated infrared input compliant with Microsoft CIR specifications. Customers are required to provide their own media center compatible remote or smart phone application for use with the Intel NUC.
PAGE 50
2.3 BIOS Security Jumper CAUTION Do not move a jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 16 shows the location of the BIOS security jumper. The 3-pin jumper determines the BIOS Security program’s mode. Table 25 describes the BIOS security jumper settings for the three modes: normal, lockdown, and configuration. Figure 16.
PAGE 51
Technical Reference Table 25 lists the settings for the jumper. Table 25. BIOS Security Jumper Settings Function/Mode Jumper Setting Configuration Normal 1-2 The BIOS uses current configuration information and passwords for booting. Lockdown 2-3 The BIOS uses current configuration information and passwords for booting, except: • All POST Hotkeys are suppressed (prompts are not displayed and keys are not accepted. For example, F2 for Setup, F10 for the Boot Menu).
PAGE 52
2.4 Mechanical Considerations 2.4.1 Form Factor The board is designed to fit into a custom chassis. Figure 17 illustrates the mechanical form factor for the board. Dimensions are given in millimeters. The outer dimensions are 101.60 millimeters by 101.60 millimeters [4.0 inches by 4.0 inches]. Figure 17.
PAGE 53
Technical Reference Figure 18 shows the height dimensions of the board. Figure 18. Board Height Dimensions 2.5 Electrical Considerations 2.5.1 Power Supply Considerations System power requirements will depend on actual system configurations chosen by the integrator, as well as end user expansion preferences. It is the system integrator’s responsibility to ensure an appropriate power budget for the system configuration is properly assessed based on the system-level components chosen. 2.5.
PAGE 54
CAUTION Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8. CAUTION The processor voltage regulator area (shown in Figure 19) can reach a temperature of up to 97.5 oC in an open chassis.
PAGE 55
Technical Reference Table 27 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 27.
PAGE 56
2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332-2 Issue 2, Method I, Case 3, 55⁰C ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF for the board is 61,444 hours. 2.8 Environmental Table 29 lists the environmental specifications for the board. Table 29.
PAGE 57
3 Overview of BIOS Features 3.1 Introduction The board uses an Intel Visual BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the Visual BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support. The initial production BIOSs are identified as AYAPLCEL.86A.
PAGE 58
system can obtain the SMBIOS information. Additional board information can be found in the BIOS under the Additional Information header under the Main BIOS page. 3.4 Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. However, this requires the addition of USB 3.
PAGE 59
Overview of BIOS Features NOTE Review the instructions distributed with the upgrade utility before attempting a BIOS update. For information about Refer to BIOS update utilities http://www.intel.com/support/motherboards/desktop/sb/CS-034499.htm 3.5.1 Language Support The BIOS Setup program and help messages are supported in US English. Check the Intel web site for support. 3.
PAGE 60
NOTE Optical drives are not supported by the onboard SATA connectors. Optical drives are supported only via the USB interfaces. 3.7.1 Network Boot The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed. Pressing the key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full. 3.7.
PAGE 61
Overview of BIOS Features 3.7.4 Power Button Menu The Power Button Menu is accessible via the following sequence: 1. 2. 3. 4. System is in S4/S5 (not G3) User pushes the power button and holds it down The power LED will change to its secondary color to signal the user to release the power button (approximately 3 seconds); alternately, the system will emit three short beeps from the PC speaker or headphones, if installed, then stop. Release immediately.
PAGE 62
3.8 Hard Disk Drive Password Security Feature The Hard Disk Drive Password Security feature blocks read and write accesses to the hard disk drive until the correct password is given. Hard Disk Drive Passwords are set in BIOS SETUP and are prompted for during BIOS POST. For convenient support of S3 resume, the system BIOS will automatically unlock drives on resume from S3. Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 19 characters in length.
PAGE 63
Overview of BIOS Features 3.9 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: • • • • • • • • The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode.
PAGE 64
4 Error Messages and Blink Codes 4.1 Front-panel Power LED Blink Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 34). Table 34. Front-panel Power LED Blink Codes Type Pattern Note BIOS update in progress Off when the update begins, then on for 0.5 seconds, then off for 0.5 seconds. The pattern repeats until the BIOS update is complete. Video error (Note) On-off (1.
PAGE 65
Regulatory Compliance and Battery Disposal Information 5 Intel NUC Kit Features 5.1 Chassis Front Panel Features Intel NUC Board NUC6CAYB board can be found integrated into Intel® NUC Kit NUC6CAYH and Intel® NUC Kit NUC6CAYS. Figure 20 shows the location of the features located on or near the front of the chassis. Figure 20. Intel NUC Kit NUC6CAYH/NUC6CAYS Features – Front Table 36 lists the components identified in Figure 20. Table 36.
PAGE 66
5.2 Chassis Rear Panel Features Figure 21 shows the location of the features located on the rear of the chassis. Figure 21. Intel NUC Kit NUC6CAYH/NUC6CAYS Features – Rear Table 37 lists the components identified in Figure 21. Table 37. Components Shown in Figure 21 Item from Figure 21 Description 19V DC Power Inlet Cooling Vents Speaker and Optical Audio Jack High Definition Multimedia Interface Connector Ethernet Port Video Graphics Array Connector USB 3.