Specification

Product Description
13
1.9 Wireless LAN Subsystem
The wireless LAN subsystem consists of the following:
• Intel® Dual Band Wireless-AC 7265 module
• 1216 BGA soldered-down
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
1.9.1 Wireless Network Module
The Dual Band Wireless-AC module provides hi-speed wireless connectivity with the following
capabilities:
• 802.11a/b/g/n, 802.11ac,
• 2.4 GHz, 5 GHz,
• Two antennas
• Dual-mode Bluetooth 4.0
For information about Refer to
Obtaining WLAN software and drivers http://downloadcenter.intel.com
1.10 Hardware Management Subsystem
The hardware management features enable the Compute Stick to be compatible with the Wired
for Management (WfM) specification. The Compute Stick has several hardware management
features, including thermal and voltage monitoring.
For information about Refer to
Wired for Management (WfM) Specification www.intel.com/design/archives/wfm/
1.11 Power Management
Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
 Power Input
 Instantly Available PC technology