Datasheet

1
System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could
resultinareductionofasmuchas1GBormoreofphysicaladdressablememorybeingavailabletotheoperatingsystemandapplications,dependingonthesystemconguration
and operating system.
2
64-bit computing on Intel® architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel® 64
architecture. Processors will not operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and
softwarecongurations.Seehttp://developer.intel.com/technology/intel64/index.htmformoreinformation.
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PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intelproductsarenotintendedforuseinmedical,life-saving,orlife-sustainingapplications.Intelmaymakechangestospecicationsandproductdescriptionsatanytime,withoutnotice.
Allproducts,dates,andguresspeciedarepreliminarybasedoncurrentexpectations,andaresubjecttochangewithoutnotice.Availabilityindifferentchannelsmayvary.
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* Other names and brands may be claimed as the property of others.
** Supports 95 W Thermal Design Power, Intel® Core™2 Quad Processors with 1333 / 1066 MHz System Bus. For information, visit processormatch.intel.com
Copyright © 2008 Intel Corporation. All rights reserved. 0408/TFC/MS/PDF 319795-001US
TechnicalSpecications
Processor
Processor Support
Intel® Core™2 Quad** processor in the LGA775
package
Intel® Core™2 Duo processor in the LGA775
package
Intel® Pentium® Dual-Core processor in the
LGA775 package
Intel® Celeron® Dual-Core processor in the
LGA775 package
Intel® Celeron® Processor 400 Sequence in the
LGA775 package
Supports Intel® 64 Architecture
2
Chipset
Intel® G45 Express Chipset
Intel® 82G45 Graphics and Memory Controller
Hub (GMCH)
Intel® 82801HR ICH10R I/O Controller Hub
Designed to support up to 8 GB
1
of system
memory using DDR2 800 / 667 SDRAM
memory
Intel® Fast Memory Access
Intel® Graphics Media Accelerator X4500HD
with Intel® Clear Video Technology
Intel® I/O Controller Hub
Five SATA ports (3.0 Gb/s) and one eSATA port
Intel® PRO 10/100/1000 Network Connection
Twelve Hi-Speed USB 2.0 ports (six back panel
ports and an additional four USB ports via two
internal headers)
System BIOS
32 Mb Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play,
IDE drive auto-congure
Advanced conguration and power interface
V1.0b, DMI 2.0, multilingual support
Intel® Rapid BIOS Boot
Optimized POST for faster access to PC from
power-on
System Memory
Memory Capacity
Four 240-pin DIMM connectors supporting
up to four double-sided DIMMs
Memory Types
DDR2 800 / 667 SDRAM memory support
Non-ECC Memory
Memory Modes
Dual- or single-channel operation support
Hardware Management Features
Processor fan speed control
System chassis fan speed control
Voltage and temperature sensing
Fan sensor inputs used to monitor fan activity
Power management support for ACPI 1.0b
High-Performance Intel® 82567LF Gigabit
Network Connections
High quality and reliability with Intel’s
world-class manufacturing and validation
Expansion Capabilities
One PCI bus add-in card connector
Two PCI Express* x1 bus add-in card connectors
One PCI Express 2.0 x16 graphics connector
Jumpers and Front-Panel Connectors
Jumpers
Single conguration jumper design
Jumper access for BIOS maintenance mode
Front-Panel Connectors
Reset, HDD LED, Power LEDs, power on/off
Consumer Infrared Receiver and Transmitter
headers
Three front-panel Hi-Speed USB 2.0 headers
One 1394a header
Front-panel audio header
One serial header
Mechanical
Board Style
ATX 2.2 compliant
Board Size
9.6” x 9.6” (24.38 cm x 24.38 cm)
Baseboard Power Requirements
ATX12V
Environment
Operating Temperature
0° C to +55° C
Storage Temperature
-40° C to +70° C
Regulations and Safety Standards
United States and Canada
CSA/UL 60950-1, First Edition
(Binational Standard)
Europe
(Low Voltage Directive 2006/95/EC)
EN 60950-1:2006
International
IEC 60950-1:2001, First Edition
EMC Regulations
(tested in representative chassis)
United States
FCC 47 CFR Part 15, Subpart B
Canada
ICES-003 Class B
Europe
(EMC Directive 2004/108/EC)
EN 55022:2006 and EN 55024:1998
Australia/New Zealand
EN 55022:2006 Class B
Japan
VCCI V-3/04.04, V-4/03.04, Class B
South Korea
KN-22:2005 and KN-24:2005
Taiwan
CNS 13438:2006 Class B
International
CISPR 22:2005 +A1:2005 +A2:2006 Class B
Environmental Compliance
Europe
Europe RoHS (Directive 2002/95/EC)
China
China RoHS (MII Order # 39)
Lead-Free: The symbol is used to
identify electrical and electronic
assemblies and components in which
the lead (Pb) concentration level in any
of the raw materials and the end product is not
greater than 0.1% by weight (1000 ppm). This
symbol is also used to indicate conformance to
lead-free requirements and denitions adopted
under the European Union’s Restriction on Haz-
ardous Substances (RoHS) directive, 2002/95/EC.
Ordering Information: See the Intel
Web site at www.intel.com. For the
most current product information,
visit developer.intel.com/design/
motherbd/