Datasheet

Technical Reference
53
2.6 Thermal Considerations
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board.
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.9.
CAUTION
The board is designed to be passively cooled on a properly ventilated chassis. Chassis
venting locations are recommended over the processor, voltage regulator, GMCH, and
system memory areas for maximum heat dissipation effectiveness.
Ensure that proper airflow is maintained around the processor, processor voltage
regulator circuit (shown in Figure 2-10), the GMCH, and the SO-DIMM. Failure to do
so may result in damage to these components.
CAUTION
A thermal rating of 85
o
C is required for the system SO-DIMM for the memory device
to tolerate passively-cooled or limited system airflow constraints.