Leaflet
Maximum Memory
Bandwidth
Maximum available memory
throughput for great HPC
application performance
Compute Density
Up to 8 Intel® Xeon® processor
E5-2600 per 2U system via 4
hot swappable half-width nodes
For more information on
Intel server solutions visit:
intelserveredge.com
For more information on Intel
server products visit:
intel.com/go/serverproducts
For product specifications
visit: ark.intel.com
For regulatory information visit:
intel.com/support/motherboards/
server/sb/CS-032524.htm
Copyright © 2014 Intel Corporation. All rights reserved. 327577-003 US 0314/GMcK/MANDISH/PDF
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS
DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING
TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTEL-
LECTUAL PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE
PERSONAL INJURY OR DEATH MAY OCCUR.
Supported Compute
Nodes
HNS2600WP: no Infiniband
HNS2600WPF: integrated InfiniBand FDR (56 Gb/s)
HNS2600WPQ: integrated InfiniBand QDR (40 Gb/s)
Processors Supported
4 x dual Intel® Xeon® processor E5 2600 or E5 2600v2 product family,
up to 135W
Total Slots
4 x 4
Slot Types
4 x 4 PCI Express* 3.0 x16
Memory Capacity
4 x 16 LR/U/RDIMMs with up to 1866MT/s, ECC
4 x 512 GB max
Chassis Form Factor
2U rack: 3.5” x 17.2” x 29.5”
Drive Options
16 x 2.5” or 12 x 3.5” hot-swap HDDs
System Cooling
3 high-speed hot-swap redundant 40mm dual rotor fans per node
Power Supply Options
2 x 1200W or 1600W AC Redundant PSU (Platinum Efficiency)
Module Upgrades
Intel® I/O Module
1
Intel® Integrated RAID ROC or IOC Module
Intel® Remote Management Module 4
1
2U 2.5” Drives
H2216XXJR
16 x 2.5” hot-swap HDD
2 x 1200W AC PSU
H2216XXKR
16 x 2.5” hot -swap HDD
2 x 1600W AC PSU
2U 3.5” Drives
H2312XXJR
12 x 3.5” hot-swap HDD
2 x 1200W AC PSU
H2312XXKR
12 x 3.5” hot-swap HDD
2 x 1600W AC PSU
Intel® Server Board S2600WP Product Family Technical Specifications
Intel may make changes to specications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked
“reserved” or “undened”. Intel reserves these for future denition and shall have no responsibility whatsoever for conicts or incompatibilities arising from future changes to them. The
information here is subject to change without notice. Do not nalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specications. Current characterized
errata are available on request. Contact your local Intel sales ofce or your distributor to obtain the latest specications and before placing your product order.
Contact your local Intel sales ofce or your distributor to obtain the latest specications and before placing your product order.
Intel, the Intel logo, and Xeon are trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
1
On interposer (need accessory kit AXXRMM410M or AXXRMM410MW).
Chassis SKUs below accommodate to up to 4 Compute Nodes
Product does not include memory, processors, or hard drives. For compatibility
information please refer to the configuration guide at www.intel.com/support