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Intel Pentium Processor B915C
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Table Of Contents
1 Introduction
1.1 Design Flow
1.2 Definition of Terms
1.3 Reference Documents
2 Packaging Technology
2.1 Non-Critical to Function Solder Joints
2.2 Package Mechanical Requirements
3 Thermal Specifications
3.1 Thermal Design Power (TDP)
3.2 Thermal Specification
4 Thermal Simulation
5 Thermal Metrology
5.1 MCH Case Measurement
5.1.1 Supporting Test Equipment
5.1.2 Thermal Calibration and Controls
5.1.3 IHS Groove
5.1.4 Thermocouple Attach Procedure
6 Reference Thermal Solution
6.1 Operating Environment
6.2 Heatsink Performance
6.3 Mechanical Design Envelope
6.4 Thermal Solution Assembly
6.4.1 Extruded Heatsink Profiles
6.4.2 Retention Mechanism Responding in Shock and Vibration
6.4.3 Thermal Interface Material
6.4.4 Reference Thermal Solution Assembly Process
6.5 Reliability Guidelines
A Thermal Solution Component Suppliers
A.1 Heatsink Thermal Solution
B Mechanical Drawings
Packaging Technology
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Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Notes:
1.
All dimensions are in millimeters.
2.
All dimensions and toler
ances conform to ANSI Y14.5 - 1994.
Figure 2-3.
MCH Package Dime
nsions (Bottom View)
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