Datasheet

Intel
®
Pentium
®
4 Processor on 0.13 Micron Process Datasheet 5
Figures
2-1 V
CC
VID Pin Voltage and Current Requirements .................................................17
2-2 Typical VCCIOPLL, VCCA and VSSA Power Distribution ..................................19
2-3 Phase Lock Loop (PLL) Filter Requirements ......................................................19
2-4 V
CC
Static and Transient Tolerance (For Intel
®
Pentium
®
4
Processor With 512-KB L2 Cache on 0.13 Micron Process)...............................29
2-5 V
CC
Static and Transient Tolerance (For Intel
®
Pentium
®
4
Processor Extreme Edition Supporting Hyper-Threading Technology)...............31
2-6 ITPCLKOUT[1:0] Output Buffer Diagram ............................................................34
2-7 Test Circuit ..........................................................................................................35
3-1 Exploded View of Processor Components on a System Board ..........................37
3-2 Processor Package .............................................................................................38
3-3 Processor Cross-Section and Keep-In ................................................................39
3-4 Processor Pin Detail............................................................................................39
3-5 IHS Flatness Specification ..................................................................................40
3-6 Processor Markings (Processors with Fixed VID) ...............................................42
3-7 Processor Markings (Processors with Multiple VID) ...........................................42
3-8 The Coordinates of the Processor Pins As Viewed from the Top
of the Package ....................................................................................................43
5-1 Example Thermal Solution (Not to Scale) ...........................................................67
5-2 Guideline Locations for Case Temperature (TC) Thermocouple Placement ......70
6-1 Stop Clock State Machine ...................................................................................72
7-1 Mechanical Representation of the Boxed Processor ..........................................77
7-2 Side View Space Requirements for the Boxed Processor ..................................78
7-3 Top View Space Requirements for the Boxed Processor ...................................79
7-4 Boxed Processor Fan Heatsink Power Cable Connector Description.................80
7-5 MotherBoard Power Header Placement Relative to Processor Socket ..............81
7-6 Boxed Processor Fan Heatsink Airspace Keep-Out Requirements
(Side 1 View) .......................................................................................................82
7-7 Boxed Processor Fan Heatsink Airspace Keep-Out Requirements
(Side 2 View) .......................................................................................................83
7-8 Boxed Processor Fan Heatsink Set Points .........................................................83