Datasheet

Intel

Pentium

4 Processor on 0.13 Micron Process Datasheet 37

Package Mechanical Specifications

Package Mechanical Specifications 3

The Pentium 4 processor on 0.13 micron process is packaged in a Flip-Chip Pin Grid Array

(FC-PGA2) package. Components of the package include an integrated heat spreader (IHS),

processor die, and the substrate which is the pin carrier. Mechanical specifications for the processor

are given in this section. See Section 1.1. for a terminology listing. The processor socket that

accepts the Pentium 4 processor on 0.13 micron process is referred to as a 478-Pin micro PGA

(mPGA478B) socket. See the Intel

Pentium

4 Processor 478-Pin Socket (mPGA478B) Socket

Design Guidelines for complete details on the mPGA478B socket.

Note: For Figure 3-1 through Figure 3-8, the following notes apply:

1. Unless otherwise specified, the following drawings are dimensioned in millimeters.

2. Figures and drawings labelled as “Reference Dimensions” are provided for informational

purposes only. Reference dimensions are extracted from the mechanical design database and

are nominal dimensions with no tolerance information applied. Reference dimensions are not

checked as part of the processor manufacturing process. Unless noted as such, dimensions in

parentheses without tolerances are reference dimensions.

3. Drawings are not to scale.

Note: Figure 3-1 is not to scale and is for reference only. The socket and system board are supplied as a

reference only.

Figure 3-1. Exploded View of Processor Components on a System Board

stem board

mPGA478B

31 mm

Heat Spreader

Substrate

35mm square

3.5mm

2.0mm

478 pins

Socket