Datasheet

Intel
®
Pentium
®
4 Processor on 0.13 Micron Process Datasheet 3
Contents
1 Introduction .................................................................................................................. 9
1.1 Terminology.........................................................................................................11
1.1.1 Processor Packaging Terminology.........................................................11
1.2 References ..........................................................................................................12
2 Electrical Specifications........................................................................................15
2.1 System Bus and GTLREF ...................................................................................15
2.2 Power and Ground Pins ......................................................................................15
2.3 Decoupling Guidelines ........................................................................................16
2.3.1 VCC
Decoupling .....................................................................................16
2.3.2 System Bus AGTL+ Decoupling.............................................................16
2.4 Voltage Identification ...........................................................................................16
2.4.1 Phase Lock Loop (PLL) Power and Filter...............................................18
2.5 Reserved, Unused Pins, and TESTHI[12:0]........................................................20
2.6 System Bus Signal Groups .................................................................................21
2.7 Asynchronous GTL+ Signals............................................................................... 22
2.8 Test Access Port (TAP) Connection....................................................................22
2.9 System Bus Frequency Select Signals (BSEL[1:0])............................................22
2.10 Maximum Ratings................................................................................................23
2.11 Processor DC Specifications...............................................................................23
2.12 AGTL+ System Bus Specifications .....................................................................35
3 Package Mechanical Specifications.................................................................37
3.1 Package Load Specifications ..............................................................................40
3.2 Processor Insertion Specifications ......................................................................41
3.3 Processor Mass Specifications ...........................................................................41
3.4 Processor Materials.............................................................................................41
3.5 Processor Markings.............................................................................................42
4 Pin Lists and Signal Descriptions.....................................................................45
4.1 Processor Pin Assignments ................................................................................45
4.2 Signal Descriptions..............................................................................................58
5 Thermal Specifications and Design Considerations.................................67
5.1 Processor Thermal Specifications.......................................................................68
5.1.1 Thermal Specifications ...........................................................................68
5.1.2 Thermal Metrology .................................................................................70
5.1.2.1 Processor Case Temperature Measurement ............................70
6Features.......................................................................................................................71
6.1 Power-On Configuration Options ........................................................................71
6.2 Clock Control and Low Power States..................................................................71
6.2.1 Normal State—State 1 ...........................................................................71
6.2.2 AutoHALT Powerdown State—State 2...................................................72
6.2.3 Stop-Grant State—State 3 .....................................................................73
6.2.4 HALT/Grant Snoop State—State 4 ........................................................73
6.2.5 Sleep State—State 5..............................................................................74