Datasheet

Thermal Specifications and Design Considerations
Datasheet 31
5 Thermal Specifications and
Design Considerations
The processor requires a thermal solution to maintain temperatures within operating
limits as set forth in Table 4-3
. Any attempt to operate the processor outside these
operating limits may result in permanent damage to the processor and potentially
other components in the system. Maintaining the proper thermal environment is the
key to reliable, long-term system operation. A complete thermal solution includes both
component and system level thermal management features.
Note: Trading thermal solutions also involves trading performance.
To allow for the optimal operation and long-term reliability of Intel processor-based
systems, the system/processor thermal solution should be designed such that the
processor remains within the minimum and maximum junction temperature (T
J
)
specifications at the corresponding Thermal Design Power (TDP) value listed in
Table 5-1
. Thermal solutions not designed to provide this level of thermal capability
may affect the long-term reliability of the processor and system.
The maximum junction temperature is defined by an activation of the processor
Intel® Thermal Monitor. Refer to Section 5.2
for more details. Analysis indicates that
real applications are unlikely to cause the processor to consume the theoretical
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the TDP indicated in Table 5-1
. The Intel®
Thermal Monitor feature is designed to help protect the processor in the unlikely event
that an application exceeds the TDP recommendation for a sustained period of time.
For more details on the usage of this feature, refer to Section 5.2
. In all cases, the
Intel® Thermal Monitor feature must be enabled for the processor to remain within
specification.
Table 5-1. Thermal Design Power Specifications
Symbol
Processor
Number
Core Frequency
Thermal Design
Power
Unit Notes
TDP Z670
1.5 GHz and HFM V
CC
0.6 GHZ and LFM V
CC
3.0
W 1,2
Symbol Parameter Min Typ Max Unit Notes
Tj Junction Temperature
0
- 90
°C
HD Streaming Scenario Power
-
1.02 -
W 3,4
NOTES:
1. The TDP specification should be used to design the processor thermal solution. The TDP
is not the maximum theoretical power the processor can generate.
2. The Intel Thermal Monitor automatic mode must be enabled for the processor to
operate within specifications.