Datasheet

Electrical Specifications
Datasheet 29
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor
frequencies.
2. VIL is defined as the maximum voltage level at a receiving agent that will be
interpreted as a logical low value.
3. VIH is defined as the minimum voltage level at a receiving agent that will be
interpreted as a logical high value.
4. VIH and VOH may experience excursions above VCCP. However, input signal drivers
must comply with the signal quality specifications.
5. RON is the pull-down driver resistance. Refer to processor I/O Buffer Models for I/V
characteristics. Measured at 0.33*VCCP.
6. GTLREF and CMREF should be generated from VCCP with a 1% tolerance resistor
divider. The VCCP referred to in these specifications is the instantaneous VCCP.
7. RTT is the on-die termination resistance measured at VOL of the AGTL+ output driver.
Measured at 0.33*VCCP. RTT is connected to VCCP on die. Refer to processor I/O
buffer models for I/V characteristics.
8. Specified with on die RTT and RON are turned off. VIN between 0 and VCCP.
9. CPAD includes die capacitance only. No package parasitics are included.
10. This is the external resistor on the component pins.
11. On die termination resistance for CMOS is measured at 0.5*VCCP.
12. RON for CMOS pull-down driver resistance. Refer to processor I/O Buffer Models for I/V
characteristics. Measured at 0.5*V
CCP
.
Table 4-7. CMOS1.8 Signal Group DC Specifications
Symbol Parameter Min. Typ. Max. Unit Notes
V
IH
Input high voltage (V
CC180
/2)
+ 0.125
− 1.9 V
V
IL
Input low voltage -0.4 − (V
CC180
/2)
- 0.125
V
V
OH
Output high voltage (V
CC180
/2)
+ 0.25
− − V
V
OL
Output low voltage − − (V
CC180
/2)
- 0.25
V
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor
frequencies.
2. V
IL
is defined as the maximum voltage level at a receiving agent that will be interpreted
as a logical low value.
3. V
IH
is defined as the minimum voltage level at a receiving agent that will be interpreted
as a logical high value.
4. V
IH
and V
OH
may experience excursions above V
CCP
. However, input signal drivers must
comply with the signal quality specifications.
Table 4-8. LVDS Signal Group DC Specifications
Symbol Parameter Min. Typ. Max. Unit Notes
V
OS
Offset voltage 1.125 1.25 1.375 V
∆V
OS
Change in offset voltage − − 50 mV
V
OD
Differential output voltage 250 350 450 mV