Datasheet

Electrical Specifications
Intel
®
Xeon
®
and Intel
®
Core™ Processors For Communications Infrastructure
May 2012 Datasheet - Volume 1 of 2
Document Number: 327405
-001 93
9.10 DC Specifications
The processor DC specifications in this section are defined at the processor pins, unless
noted otherwise. See Chapter 10.0 for the processor pin listings and Chapter 8.0 for
signal definitions.
The DC specifications for the DDR3 signals are listed in Table 9-10. Control Sideband
and Test Access Port (TAP) are listed in Table 9-11.
Table 9-5 through Table 9-9 lists the DC specifications for the processor and are valid
only while meeting specifications for junction temperature, clock frequency, and input
voltages. Read all notes associated with each parameter.
AC tolerances for all DC rails include dynamic load currents at switching frequencies up
to 1 MHz.
Table 9-4. Storage Condition Ratings
Symbol Parameter Min Max Notes
T
absolute storage
The non-operating device storage
temperature. Damage (latent or otherwise)
may occur when exceeded for any length of
time.
-25°C 125°C 1, 2, 3, 4
T
sustained storage
The ambient storage temperature (in shipping
media) for a sustained period of time).
-5°C 40°C 5, 6
T
short term storage
The ambient storage temperature (in shipping
media) for a short period of time.
-20°C 85°C
RH
sustained storage
The maximum device storage relative
humidity for a sustained period of time.
60% @ 24°C 6, 7
Time
sustained storage
A prolonged or extended period of time;
typically associated with customer shelf life.
0 Months 6 Months 7
Time
short term storage
A short-period of time. 0 hours 72 hours
Notes:
1. Refers to a component device that is not assembled in a board or socket and is not electrically
connected to a voltage reference or I/O signal.
2. Specified temperatures are not to exceed values based on data collected. Exceptions for surface
mount reflow are specified by the applicable JEDEC standard. Non-adherence may affect processor
reliability.
3. T
absolute storage
applies to the unassembled component only and does not apply to the shipping media,
moisture barrier bags, or desiccant.
4. Component product device storage temperature qualification methods may follow JESD22-A119 (low
temp) and JESD22-A103 (high temp) standards when applicable for volatile memory.
5. Intel® branded products are specified and certified to meet the following temperature and humidity
limits that are given as an example only (Non-Operating Temperature Limit: -40°C to 70°C and
Humidity: 50% to 90%, non-condensing with a maximum wet bulb of 28°C.) Post board attach
storage temperature limits are not specified for non-Intel branded boards.
6. The JEDEC J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
sensitive devices removed from the moisture barrier bag.
7. Nominal temperature and humidity conditions and durations are given and tested within the
constraints imposed by T
sustained storage
and customer shelf life in applicable Intel boxes and bags.