Datasheet

Processor SKUs
Intel
®
Xeon
®
and Intel
®
Core™ Processors For Communications Infrastructure
May 2012 Datasheet - Volume 1 of 2
Document Number: 327405
-001 45
5.0 Processor SKUs
5.1 Overview
This section details the features of the various SKUs of the Intel
®
Xeon
®
and Intel
®
Core™ Processors for Communications Infrastructure. The mix of SKUs are chosen to
span cost, performance, temperature environment and power consumption.
5.1.1 SKU Features
Table 5-1 outlines the processor SKUs available.
§ §
Table 5-1. Base Features by SKU
Intel
®
Xeon
®
and Intel
®
Core™ Processors for Communications Infrastructure
Product Name
Intel
®
Xeon
®
Processor
E3-1125C
Intel
®
Xeon
®
Processor
E3-1105C
Intel
®
Core™
i3 Processor
2115C
Intel
®
Pentium
®
Processor
B915C
Intel
®
Celeron
®
Processor
725C
Target Core Speed (GHz) 2.0 1.0 2.0 1.5 1.3
Active Cores 44221
TDP
1
(Watts) 4025251510
Die Type 4 Core 4 Core 2 Core 2 Core 2 Core
L3 Cache (MB) 8 6 3 3 1.5
Memory Channels 2 2 2 2 1
ECC Memory Yes
PCI-Express* (lanes) 20 16
PCI-Express* (root) 1x16 +1x4 or 2x8 +1x4 or 1x8 +3x4
1x16 or 2x8 or
1x8 +2x4
Junction Temperature T
J-Min
= 0
o
C, T
J-MAX
= 100
o
C
Intel
®
Virtualization Technology Yes
Intel
®
Hyper-Threading
Technology
Yes
Intel
®
Trusted Execution
Technology
No
Graphics No
Intel
®
Turbo Boost No
Note:
1. Thermal Design Power (TDP) is a system design target associated with the maximum component operating
temperature specifications. TDP values are determined based on typical DC electrical specification and
maximum component temperature for a realistic-case application running at maximum utilization.