Datasheet

Product Overview
Intel
®
Xeon
®
and Intel
®
Core™ Processors For Communications Infrastructure
May 2012 Datasheet - Volume 1 of 2
Document Number: 327405
-001 21
2.5 Power Management Support
2.5.1 Processor Core
• Full support of ACPI C-states as implemented by the following processor C-states:
C0, C1, C1E, C3, C6, C7
• Enhanced Intel SpeedStep
®
Technology
2.5.2 System
Full support of the ACPI S-states as implemented by the following system S-states:
S0, S3, S4, S5
2.5.3 Memory Controller
• Conditional self-refresh (Intel
®
Rapid Memory Power Management (Intel
®
RMPM))
• Dynamic power-down
2.5.4 PCI Express*
• L0s and L1 ASPM power management capability
2.5.5 DMI
• L0s and L1 ASPM power management capability
2.6 Thermal Management Support
• Digital Thermal Sensor
•Intel
®
Adaptive Thermal Monitor
• THERMTRIP# and PROCHOT# support
• On-Demand Mode
• Memory Thermal Throttling
• External Thermal Sensor (TS-on-DIMM and TS-on-Board)
• Fan speed control with DTS
2.7 Package
• The processor is available in one package size:
— A 37.5 x 37.5 mm 1284-ball FCBGA package (BGA1284)
— 1.016 mm ball pitch
2.8 Testability
The processor includes boundary-scan for board and system level testability.
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