Datasheet

Product Overview
Intel
®
Xeon
®
and Intel
®
Core™ Processors For Communications Infrastructure
May 2012 Datasheet - Volume 1 of 2
Document Number: 327405
-001 17
2.1 Product Features
2.2 Processor Details
Four, two or single execution cores (4C, 2C or 1C respectively)
32-KB data first-level cache (L1) for each core, parity protected
32-KB instruction first-level cache (L1) for each core, ECC protected
256-KB shared instruction/data second-level cache (L2) for each core, ECC
protected
Up to 8-MB shared instruction/data third-level cache (L3) across all cores, ECC
protected
2.3 Supported Technologies
•Intel
®
Virtualization Technology for Directed I/O (Intel
®
VT-d)
•Intel
®
Virtualization Technology (Intel
®
VT-x)
•Intel
®
Streaming SIMD Extensions 4.1 (Intel
®
SSE4.1)
•Intel
®
Streaming SIMD Extensions 4.2 (Intel
®
SSE4.2)
•Intel
®
Hyper-Threading Technology
•Intel
®
64 Architecture
Execute Disable Bit
•Intel
®
Advanced Vector Extensions (Intel
®
AVX)
Advanced Encryption Standard New Instructions (AES-NI)
PCLMULQDQ Instruction
2.4 Interface Features
2.4.1 System Memory Support
One or two channels of DDR3 memory with a maximum of two UDIMMs or two SO-
DIMMs per channel
ECC Memory Down topology of up to eighteen x8 SDRAM Devices per channel
Non-ECC Memory Down topology of up to eight x16 DDR3 SDRAM Devices per
channel
Single- and dual-channel memory organization modes
Memory capacity supported from 512 MB up to 32 GB
Using 4-Gb device technologies, the largest total memory capacity possible is 32
GB, assuming Dual Channel Mode with four x8, double-sided, dual ranked
unbuffered DIMM memory configuration
1-Gb, 2-Gb and 4-Gb DDR3 DRAM technologies are supported for x8 and x16
devices
Using 4Gb device technology, the largest memory capacity possible is 16 GB,
assuming dual-channel mode with two x8, dual-ranked, un-buffered, DIMM
memory configuration.
Data burst length of eight for all memory organization modes
Memory DDR3 data transfer rates of 1066 MT/s, 1333 MT/s and 1600 MT/s