Datasheet

Datasheet 3
Contents
1 Introduction.....................................................................................................6
1.1 Major Features.......................................................................................6
1.2 Terminology ..........................................................................................7
1.3 References............................................................................................9
2 Low Power Features ........................................................................................10
2.1 Clock Control and Low-power States .......................................................10
2.1.1 Thread Low-power State Descriptions.........................................12
2.1.2 Package Low-power State Descriptions.......................................13
2.2 Dynamic Cache Sizing...........................................................................16
2.3 Enhanced Intel SpeedStep
®
Technology...................................................17
2.4 Enhanced Low-Power States ..................................................................18
2.5 FSB Low Power Enhancements ...............................................................19
2.5.1 Front Side Bus........................................................................19
3 Electrical Specifications....................................................................................20
3.1 Power and Ground Pins .........................................................................20
3.2 FSB Clock (BCLK [1:0]) and Processor Clocking ........................................20
3.3 Voltage Identification............................................................................20
3.4 Catastrophic Thermal Protection.............................................................23
3.5 Reserved and Unused Pins.....................................................................23
3.6 FSB Frequency Select Signals (BSEL [2:0])..............................................23
3.7 FSB Signal Groups................................................................................24
3.8 CMOS Asynchronous Signals..................................................................25
3.9 Maximum Ratings.................................................................................25
3.10 Processor DC Specifications ...................................................................26
4 Package Mechanical Specifications and Pin Information.........................................33
4.1 Package Mechanical Specifications ..........................................................33
4.1.1 Package Mechanical Drawings ...................................................34
4.2 Processor Pin-out Assignment ................................................................34
4.3 Signal Description ................................................................................41
5 Thermal Specifications and Design Considerations ...............................................50
5.1 Thermal Diode.....................................................................................51
5.2 Intel® Thermal Monitor.........................................................................53
5.3 Digital Thermal Sensor..........................................................................55
5.3.1 Out of Specification Detection ...................................................56
5.3.2 PROCHOT# Signal Pin..............................................................56