Datasheet

Electrical Specifications
Intel
®
Xeon
®
Processor C5500/C3500 Series
Datasheet, Volume 1 January 2010
504 Order Number: 323103-001
I
CC_MAX
I
CCPLL_MAX
I
DDQ_MAX
I
TT_MAX
P1053: TDP = 50W
V
CC
V
CCPLL
V
DDQ
V
TTA
V
TTD
13
1.5
4.5
4.2
22
A11
LC3528: TDP = 32W
V
CC
V
CCPLL
V
DDQ
V
TTA
V
TTD
24
1.5
5.5
4
15
A11
LC3518: TDP = 23W
V
CC
V
CCPLL
V
DDQ
V
TTA
V
TTD
11
1.5
4.5
4
13
A11
I
DDQ_S3
DDR3 System Memory
Interface Supply Current in
Standby State
V
DDQ
A
Table 162. Voltage and Current Specifications (Sheet 3 of 3)
Symbol Parameter
Voltage
Plane
Min Typ Max Unit Notes
1
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processors. These specifications are
based on pre-silicon characterization and will be updated as further data becomes available.
2. Individual processor VID and/or VTT_VID values may be calibrated during manufacturing such that
two devices at the same speed may have different settings.
3. These voltages are targets only. A variable voltage source should exist on systems in the event that a
different voltage is required.
4. The V
CC
voltage specification requirements are measured across vias on the platform for VCCSENSE
and VSSSENSE pins close to the socket with a 100 MHz bandwidth oscilloscope, 1.5 pF maximum
probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground wire on the probe
should be less than 5 mm. Ensure external noise from the system is not coupled in the scope probe.
5. The V
TT
voltage specification requirements are measured across platform vias for VTTD_SENSE and
VSS_SENSE_VTTD lands close to the socket with a 100 MHz bandwidth oscilloscope, 1.5 pF maximum
probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground wire on the probe
should be less than 5 mm. Ensure external noise from the system is not coupled in the scope probe.
6. See Table 163 and corresponding Figure 86. The processor should not be subjected to any static V
CC
level that exceeds the V
CC_MAX
associated with any particular current. Failure to adhere to this
specification can shorten processor lifetime.
7. Minimum V
CC
and maximum I
CC
are specified at the maximum processor case temperature (T
CASE
)
shown in the Intel
®
Xeon
®
Processor C5500/C3500 Series Thermal / Mechanical Design Guide.
I
CC_MAX
is specified at the relative V
CC_MAX
point on the V
CC
load line. The processor is capable of
drawing I
CC_MAX
for up to 10 ms.
8. See Table 173. Do not subject processor to any static V
TT
level exceeding V
TT_MAX
associated with any
particular current. Failure to adhere to this specification can shorten processor lifetime.
9. This specification represents the V
CC
reduction due to each VID transition. See Section 13.1.10.3. .
10. Baseboard bandwidth is limited to 20 MHz.
11. FMB is the flexible motherboard guidelines. See Section 13.4 for FMB details.