Datasheet

Electrical Specifications
Intel
®
Xeon
®
Processor C5500/C3500 Series
Datasheet, Volume 1 January 2010
500 Order Number: 323103-001
13.3 Mixing Processors
Intel supports and validates dual processor configurations only in which both
processors operate with the same Intel
®
QuickPath Interconnect frequency, core
frequency, power segment, and have the same internal cache sizes. Mixing components
operating at different internal clock frequencies is not supported and will not be
validated by Intel. Combining processors from different power segments is also not
supported.
Note: Processors within a system must operate at the same frequency per bits [15:8] of the
FLEX_RATIO MSR (Address: 194h); however this does not apply to frequency
transitions initiated due to thermal events, Extended HALT, Enhanced Intel SpeedStep
®
Technology transitions signal (See Section 8.0, “Power Management”).
Not all operating systems can support dual processors with mixed frequencies. Mixing
processors of different steppings but the same model (as per CPUID instruction) is
supported. Details regarding the CPUID instruction are provided in the AP-485, Intel
®
Processor Identification and the CPUID Instruction application note. See also the
Intel
®
Xeon
®
Processor C5500/C3500 Series Specification Update for details.
13.4 Flexible Motherboard Guidelines (FMB)
The Flexible Motherboard (FMB) guidelines are estimates of the maximum values the
Intel
®
Xeon
®
processor C5500/C3500 series will have over certain time periods. The
values are only estimates and actual specifications for future processors may differ.
Processors may or may not have specifications equal to the FMB value in the
foreseeable future. System designers should meet the FMB values to ensure their
systems will be compatible with future Bloomfield processor.
13.5 Absolute Maximum and Minimum Ratings
Note: All specifications are pre-silicon estimates and are subject to change.
Table 161 specifies absolute maximum and minimum ratings which lie outside the
functional limits of the processor. Only within specified operation limits, can
functionality and long-term reliability be expected.
At conditions outside functional operation condition limits, but within absolute
maximum and minimum ratings, neither functionality nor long-term reliability can be
expected. If a device is returned to conditions within functional operation limits after
having been subjected to conditions outside these limits, but within the absolute
maximum and minimum ratings, the device may be functional, but with its lifetime
degraded depending on exposure to conditions exceeding the functional operation
condition limits.
At conditions exceeding absolute maximum and minimum ratings, neither functionality
nor long-term reliability can be expected. Moreover, if a device is subjected to these
conditions for any length of time then, when returned to conditions within the
functional operating condition limits, it will either not function or its reliability will be
severely degraded.
Although the processor contains protective circuitry to resist damage from static
electric discharge, precautions should always be taken to avoid high static voltages or
electric fields.