Datasheet

Datasheet 5
Figures
1Intel
®
Core™2 Duo Processor E8000 Series V
CC
Static and Transient Tolerance................ 21
2Intel
®
Core™2 Duo Processor E7000 Series V
CC
Static and Transient Tolerance................ 23
3V
CC
Overshoot Example Waveform ............................................................................. 24
4 Differential Clock Waveform ...................................................................................... 34
5 Measurement Points for Differential Clock Waveforms ................................................... 34
6 Processor Package Assembly Sketch ........................................................................... 35
7 Processor Package Drawing Sheet 1 of 3 ..................................................................... 36
8 Processor Package Drawing Sheet 2 of 3 ..................................................................... 37
9 Processor Package Drawing Sheet 3 of 3 ..................................................................... 38
10 Processor Top-Side Markings Example ........................................................................ 40
11 Processor Land Coordinates and Quadrants, Top View ................................................... 41
12 land-out Diagram (Top View – Left Side) ..................................................................... 44
13 land-out Diagram (Top View – Right Side) ................................................................... 45
14 Intel
®
Core™2 Duo Processor E8000 Series Thermal Profile ........................................... 79
15 Intel
®
Core™2 Duo Processor E7000 Series Thermal Profile ........................................... 80
16 Case Temperature (TC) Measurement Location ............................................................ 81
17 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 83
18 Conceptual Fan Control Diagram on PECI-Based Platforms............................................. 85
19 Processor Low Power State Machine ........................................................................... 88
20 Mechanical Representation of the Boxed Processor ....................................................... 93
21 Space Requirements for the Boxed Processor (Side View).............................................. 94
22 Space Requirements for the Boxed Processor (Top View)............................................... 94
23 Overall View Space Requirements for the Boxed Processor............................................. 95
24 Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 96
25 Baseboard Power Header Placement Relative to Processor Socket................................... 97
26 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ................... 98
27 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ................... 98
28 Boxed Processor Fan Heatsink Set Points..................................................................... 99