Datasheet

Datasheet 5
3-6 Processor Land Coordinates and Quadrants, Top View...............................................40
4-1 land-out Diagram (Top View – Left Side)................................................................. 42
4-2 land-out Diagram (Top View – Right Side)...............................................................43
5-1 Quad-Core Intel
® Xeon® Processor 3300 Series
Thermal Profile(95W)................................78
5-2 Quad-Core Intel
®
Xeon
®
Processor 3300 Series Thermal Profile (65W) ....................... 79
5-3 Case Temperature (TC) Measurement Location ........................................................80
5-4 Thermal Monitor 2 Frequency and Voltage Ordering..................................................82
5-5 Conceptual Fan Control Diagram on PECI-Based Platforms ........................................84
6-1 Processor Low Power State Machine .......................................................................88
7-1 Mechanical Representation of the Boxed Processor ...................................................91
7-2 Side View Space Requirements for the Boxed Processor............................................92
7-3 Top View Space Requirements for the Boxed Processor.............................................93
7-4 Overall View Space Requirements for the Boxed Processor ........................................93
7-5 Boxed Processor Fan Heatsink Power Cable Connector Description.............................. 95
7-6 Baseboard Power Header Placement Relative to Processor Socket...............................96
7-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ...............97
7-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ...............98
7-9 Boxed Processor Fan Heatsink Set Points ................................................................ 99
Tables
1-1 References..........................................................................................................11
2-1 Voltage Identification Definition ............................................................................. 14
2-2 Absolute Maximum and Minimum Ratings................................................................17
2-3 Voltage and Current Specifications.........................................................................18
2-4 V
CC
Static and Transient Tolerance......................................................................... 19
2-5 V
CC
Overshoot Specifications.................................................................................21
2-6 FSB Signal Groups ...............................................................................................23
2-7 Signal Characteristics...........................................................................................24
2-8 Signal Reference Voltages.....................................................................................24
2-9 GTL+ Signal Group DC Specifications .....................................................................24
2-10 Open Drain and TAP Output Signal Group DC Specifications.......................................25
2-11 CMOS Signal Group DC Specifications.....................................................................25
2-12 PECI DC Electrical Limits.......................................................................................26
2-13 GTL+ Bus Voltage Definitions ................................................................................27
2-14 Core Frequency to FSB Multiplier Configuration........................................................ 28
2-15 BSEL[2:0] Frequency Table for BCLK[1:0]...............................................................29
2-16 Front Side Bus Differential BCLK Specifications ........................................................30
2-17 FSB Differential Clock Specifications (1333 MHz FSB) ............................................... 30
3-1 Processor Loading Specifications............................................................................ 38
3-2 Package Handling Guidelines.................................................................................38
3-3 Processor Materials ..............................................................................................39
4-1 Alphabetical Land Assignments..............................................................................44
4-2 Numerical Land Assignment .................................................................................. 54
4-3 Signal Description................................................................................................64
5-1 Processor Thermal Specifications ...........................................................................76
5-2 Quad-Core Intel
® Xeon® Processor 3300 Series
Thermal Profile (95W)...............................77
5-3 Quad-Core Intel
® Xeon® Processor 3300 Series
Thermal Profile (65W)...............................79
5-4 GetTemp0() Error Codes.......................................................................................85
6-1 Power-On Configuration Option Signals................................................................... 87
7-1 Fan Heatsink Power and Signal Specifications ..........................................................95
7-2 Fan Heatsink Power and Signal Specifications ..........................................................99