32-Bit High-Performance Superscalar Processor Data Sheet

80960HA/HD/HT
Datasheet 33
Table 14. Maximum T
A
at Various Airflows in ° C (PQ4 Package Only)
Airflow-ft/min (m/sec)
f
CLKIN
(MHz)
0
(0)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
1000
(5.07)
Core
1X Bus
Clock
T
A
with
Heatsink
25
33
40
71
67
63
76
74
71
79
77
75
79
77
75
80
79
77
80
79
77
T
A
without
Heatsink
25
33
40
70
65
61
73
68
65
75
72
69
75
72
69
76
74
71
76
74
71
Core
2X Bus
Clock
T
A
with
Heatsink
16
25
33
40
71
62
55
48
76
71
66
62
79
75
71
68
79
75
71
68
80
77
74
72
80
77
74
72
T
A
without
Heatsink
16
25
33
40
69
60
52
42
72
64
57
51
75
68
63
58
75
68
63
58
76
71
66
62
76
71
66
62
Core
3X Bus
Clock
T
A
with
Heatsink
20
25
58
51
68
64
73
70
73
70
76
73
76
73
T
A
without
Heatsink
20
25
56
48
61
55
66
61
66
61
68
64
68
64
0.285 high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
Table 15. 80960Hx 208-Pin PQ4 Package Thermal Characteristics
Thermal Resistance ° C/Watt
Parameter
Airflow ft./min (m/sec)
0
(0)
200
(1.01)
400
(2.03)
600
(3.07)
800
(4.06)
1000
(5.07)
θ Junction-to-Case
(Case measured as
shown in Figure 5.)
111111
θ Case-to-Ambient
(No Heatsink)
12108877
θ Case-to-Ambient
(With Heatsink)
3
1175544
NOTES:
1. This table applies to 80960Hx PQ4 plugged into socket or soldered directly to board.
2.
θ
JA
= θ
JC
+ θ
CA
3. 0.285 high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
θ
JC
θ
JA