Datasheet

BOXED PROCESSOR SPECIFICATIONS
85
E
F
Figure 35. Front View Space Requirements for the Boxed Processor
9.2.1 BOXED PROCESSOR HEATSINK DIMENSIONS
Table 53. Boxed Processor Heatsink Dimensions
Fig. Ref.
Label
Dimensions (Inches) Min Typ Max
A Heatsink Depth (off heatsink attach point) 1.03
B Heatsink Height (above baseboard) 0.485
C Heatsink Base Thickness 0.200
D Heatsink Total Height at Fins 4.065
E Heatsink Total Height at Base (see front view) 4.235
F Heatsink Width (see front view) 5.05
9.2.2 BOXED PROCESSOR HEATSINK WEIGHT
The boxed processor heatsink will not weigh more than 350 grams (without auxiliary fan).
9.2.3 BOXED PROCESSOR RETENTION MECHANISM
The boxed Pentium® III Xeon™ processor at 700 MHz and 900 MHz requires a retention mechanism that
supports and secures the Single Edge Contact Cartridge (S.E.C.C.) in the 330-contact slot connector. An
S.E.C.C. retention mechanism is not provided with the boxed processor. Baseboards designed for use by
system integrators should include a retention mechanism and appropriate installation instructions. The boxed