Datasheet

90 Datasheet
Boxed Processor Specifications
6.2.2 Intel
®
Boxed Processor Fan Heatsink Weight
The boxed processor fan heatsink will not weigh more than 225 grams. See Section 4.0 and
Section 5.0 for details on the processor weight and heatsink requirements.
6.2.3 Intel
®
Boxed Processor Retention Mechanism
The boxed processor requires processor retention mechanism(s) to secure the processor in the
242-contact slot connector. S.E.C.C.2 processors must use either retention mechanisms described
in AP-826, Mechanical Assembly and Customer Manufacturing Technology for S.E.P. Packages
(Document Number 243748) or Universal Retention Mechanisms that accept S.E.C.C., S.E.P.P.
and S.E.C.C.2 packaged processors. The boxed processor will not ship with a retention
mechanism. Baseboards designed for use by system integrators must include retention
mechanisms that support the S.E.C.C.2 package and the appropriate installation instructions.
Figure 53. Top View Air Space Requirements for the Intel
®
Boxed Processor
Table 38. Intel
®
Boxed Processor Fan Heatsink Spatial Dimensions
Fig. Ref.
Label
Refers to
Figure Dimensions (Inches) Min Typ Max
A 51
S.E.C.C.2 Fan Heatsink Depth (off processor
substrate)
1.48
B 51 S.E.C.C.2 Fan Heatsink Height Above Baseboard 0.4
C 52 S.E.C.C.2 Fan Heatsink Height 2.2
D 52 S.E.C.C.2 Fan Heatsink Width (plastic shroud only) 4.9
E 52
S.E.C.C.2 Power Cable Connector Location from
Edge of Fan Heatsink Shroud
1.4 1.45
F 53 Airflow keep-out zones from end of fan heatsink 0.40
G 53 Airflow keep-out zones from face of fan heatsink 0.20