Datasheet

Datasheet 7
18 System Bus AC Specifications (TAP Connection) at the Processor
Core Pins.............................................................................................................36
19 BCLK, PICCLK, and PWRGOOD Signal Quality Specifications at the
Processor Core ...................................................................................................40
20 100 MHz AGTL+ Signal Group Overshoot/Undershoot Tolerance .....................44
21 133 MHz AGTL+ Signal Group Overshoot/Undershoot Tolerance .....................45
22 33 MHz Non-AGTL+ Signal Group Overshoot/Undershoot Tolerance................45
23 Signal Ringback Specifications for Signal Simulation .........................................47
24 AGTL+ and Non-AGTL+ Signal Groups Ringback Tolerance Specifications......47
25 Thermal Specifications for S.E.C.C. Packaged Processors................................50
26 Thermal Specifications for S.E.C.C.2 Packaged Processors..............................51
27 Thermal Diode Parameters .................................................................................53
28 Thermal Diode Interface......................................................................................53
29 Description Table for Processor Markings (S.E.C.C. Packaged Processor).......61
30 Description Table for Processor Markings (S.E.C.C.2 Packaged Processor).....67
31 S.E.C.C.2 Pressure Specifications......................................................................68
32 S.E.C.C. Materials...............................................................................................69
33 S.E.C.C.2 Materials.............................................................................................69
34 Signal Listing in Order by Pin Number ................................................................70
35 Signal Listing in Order by Signal Name...............................................................73
36 Via Listing in Order by Signal Name ...................................................................77
37 Via Listing in Order by VIA Location....................................................................82
38 Intel
®
Boxed Processor Fan Heatsink Spatial Dimensions .................................90
39 Fan Heatsink Power and Signal Specifications...................................................91
40 Baseboard Fan Power Connector Location ........................................................92
41 Signal Description ...............................................................................................93
42 Output Signals...................................................................................................100
43 Input Signals......................................................................................................100
44 Input/Output Signals (Single Driver)..................................................................101
45 Input/Output Signals (Multiple Driver) ...............................................................101