Datasheet

Datasheet 69
S.E.C.C. and S.E.C.C.2 Mechanical Specifications
5.4 Processor Package Materials Information
Both the S.E.C.C. and S.E.C.C.2 processor packages are comprised of multiple pieces to make the
complete assembly. This section provides the weight of each piece and the entire package. Table 32
and Table 33 contain piece-part information of the S.E.C.C. and S.E.C.C.2 processor packages,
respectively.
5.5 Intel
®
Pentium
®
III Processor Signal Listing
Table 34 and Table 35 provide the processor edge finger signal definitions. The signal locations on
the SC242 edge connector are to be used for signal routing, simulation, and component placement
on the baseboard.
Table 34 is the Pentium III processor substrate edge finger listing in order by pin number. Table 35
is the Pentium III processor substrate edge connector listing in order by signal name.
Table 32. S.E.C.C. Materials
S.E.C.C. Piece Piece Material Maximum Piece Weight (Grams)
Extended Thermal Plate Aluminum 6063-T6 84.0
Latch Arms GE Lexan 940-V0, 30% glass filled Less than 2.0 per latch arm
Cover GE Lexan 940-V0 24.0
Total Pentium III Processor 112.0
Table 33. S.E.C.C.2 Materials
S.E.C.C.2 Piece Piece Material Maximum Piece Weight (Grams)
Cover GE Lexan 940-V0 18.0
Total Pentium III Processor 54.0