Datasheet

Datasheet 67

S.E.C.C. and S.E.C.C.2 Mechanical Specifications

5.3 S.E.C.C.2 Structural Mechanical Specification

The intention of the structural specification for S.E.C.C.2 is to ensure that the package will not be

exposed to excessive stresses that could adversely affect device reliability. Figure 45 illustrates the

deflection specification for deflections away from the heatsink. Figure 46 illustrates the deflection

specification in the direction of the heatsink.

The heatsink attach solution must not induce permanent stress into the S.E.C.C.2 substrate with the

exception of a uniform load to maintain the heatsink to the processor thermal interface. Figure 47

and Table 31 define the pressure specification.

Figure 44. Intel

Pentium

III Processor Markings (S.E.C.C.2 Package)

Table 30. Description Table for Processor Markings (S.E.C.C.2 Packaged Processor)

Code Letter Description

A Logo

C Trademark

D Logo

F Dynamic Mark Area – with 2-D matrix

NOTE:

Please refer to the Pentium

III

Processor Specification Update

for this information.

"""" " """ "" "

""""" " " " "

""" " " " """"

"""" "" """ ""

" " " " "" " " "

"""" " " " " ""

""" " "" """ " "

"" "" " "" " ""

" " " """"" ""

" " " "" "

Figure 45. Substrate Deflection away from Heatsink

F/2 F/2

5 cycles maximum

0.025

Processor Substrate