Datasheet

64 Datasheet
S.E.C.C. and S.E.C.C.2 Mechanical Specifications
Figure 38. S.E.C.C.2 Packaged Processor Substrate — Edge Finger Contact Dimensions
Figure 39. S.E.C.C.2 Packaged Processor Substrate — Edge Finger Contact
Dimensions (Detail A)
.045+.007
.062
-.005
.039
.037
.074 ±.002
.236
.045
121 X 0.043 ±.002
.138 ±.005
.008
.360
.010
121 X 0.16 ±.00
2
Y
Pin A73
Pin A74
NOTE:
1. All dimensions without tolerance information are considered reference dimensions o
n
.008
Z W
.002
Z
.008
Z W
.002
Z
W
Keep Out Zone (Front Side View)