Datasheet

Datasheet 61
S.E.C.C. and S.E.C.C.2 Mechanical Specifications
5.2 S.E.C.C.2 Mechanical Specification
S.E.C.C.2 drawings and dimension details are provided in Figure 32 through Figure 44. Figure 32
shows multiple views of the Pentium III processor in an S.E.C.C.2 package; Figure 33 through
Figure 37 show an S.E.C.C.2 package dimensions; Figure 38 and Figure 39 provide dimensions of
the processor substrate edge finger contacts; Figure 40 shows the heatsink solution keep-in zone;
Figure 42 shows multiple views of an S.E.C.C.2 packaged processor keep-out zone; and Figure 44
and Table 40 contain processor marking information. See Section 5.1 for S.E.C.C. Mechanical
Specifications.
Table 29. Description Table for Processor Markings (S.E.C.C. Packaged Processor)
Code Letter Description
A Logo
C Trademark
D Logo
E Product Name
F Dynamic Mark Area – with 2-D matrix
Figure 32. S.E.C.C.2 Packaged Processor — Multiple Views
Top View
Cover Side View
Right Side
View
Substrate View
OLGA PackageCover
L2 Cache
(CPUID 067xh Only
Pentium
®
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