Datasheet

6 Datasheet
39 S.E.C.C.2 Packaged Processor Substrate — Edge Finger Contact
Dimensions (Detail A) .........................................................................................64
40 S.E.C.C.2 Packaged Processor Substrate (CPUID=067xh) —
Keep-In Zones.....................................................................................................65
41 S.E.C.C.2 Packaged Processor Substrate (CPUID=068xh) —
Keep-In Zones.....................................................................................................65
42 S.E.C.C.2 Packaged Processor Substrate (CPUID=067xh) —
Keep-Out Zone....................................................................................................66
43 S.E.C.C.2 Packaged Processor Substrate (CPUID=068xh) —
Keep-Out Zone....................................................................................................66
44 Intel
®
Pentium® III Processor Markings (S.E.C.C.2 Package) ...........................67
45 Substrate Deflection away from Heatsink ........................................................... 67
46 Substrate Deflection toward the Heatsink ...........................................................68
47 S.E.C.C.2 Packaged Processor Specifications...................................................68
48 Processor Core Pad Via Assignments ................................................................76
49 Intel
®
Pentium
®
III Processor S.E.C.C. 2 Via Map..............................................87
50 Boxed Intel
®
Pentium
®
III Processor in the S.E.C.C.2 Packaging
(Fan Power Cable Not Shown) ...........................................................................88
51 Side View Space Requirements for the Intel
®
Boxed Processor with
S.E.C.C.2 Packaging .......................................................................................... 89
52 Front View Space Requirements for the Intel
®
Boxed Processor with
S.E.C.C.2 Packaging .......................................................................................... 89
53 Top View Air Space Requirements for the Intel
®
Boxed Processor....................90
54 Intel
®
Boxed Processor Fan Heatsink Power Cable Connector Description.......91
55 Recommended Baseboard Power Header Placement Relative to Fan
Power Connector and Intel
®
Pentium
®
III Processor...........................................92
Tables
1 Processor Identification.......................................................................................11
2 Related Documents ............................................................................................12
3 Voltage Identification Definition...........................................................................19
4 System Bus Signal Groups .................................................................................21
5 Frequency Select Truth Table for BSEL[1:0] ......................................................22
6 Absolute Maximum Ratings (CPUID=067xh)...................................................... 24
7 Absolute Maximum Ratings (CPUID=068xh)...................................................... 25
8 Voltage and Current Specifications..................................................................... 26
9 AGTL+ Signal Groups DC Specifications............................................................31
10 Non-AGTL+ Signal Group DC Specifications......................................................31
11 AGTL+ Bus Specifications ..................................................................................32
12 System Bus AC Specifications (Clock) at Processor Core Pins .........................33
13 Valid System Bus, Core Frequency, and Cache Bus Frequencies.....................34
14 System Bus AC Specifications (AGTL+ Signal Group) at the Processor
Core Pins ............................................................................................................35
15 System Bus AC Specifications (CMOS Signal Group) at the Processor
Core Pins ............................................................................................................35
16 System Bus AC Specifications (Reset Conditions).............................................35
17 System Bus AC Specifications (APIC Clock and APIC I/O) at the Processor
Core Pins ............................................................................................................36