Datasheet

50 Datasheet
Thermal Specifications and Design Considerations
4.1 Thermal Specifications
Table 25 and Table 26 provide the thermal design power dissipation and maximum and minimum
temperatures for Pentium III processors with S.E.C.C. and S.E.C.C.2 package technologies
respectively. While the processor core dissipates the majority of the thermal power, thermal power
dissipated by the L2 cache also impacts the overall processor power specification. This total
thermal power is referred to as processor power in the following specifications. Systems should
design for the highest possible processor power, even if a processor with a lower thermal
dissipation is planned.
NOTES:
1. These values are specified at nominal V
CC
CORE
for the processor core and nominal VCC
L2
/VCC
3.3
for the L2
cache (if applicable).
2. Processor power includes the power dissipated by the processor core, the L2 cache, and the AGTL + bus
termination. The maximum power for each of these components does not occur simultaneously.
3. Extended Thermal Plate power is the processor power that is dissipated through the extended thermal plate.
Figure 19. S.E.C.Cartridge 2 — Substrate View
Substrate View
OLGA Package
L2 Cache
(CPUID 067xh Only
Table 25. Thermal Specifications for S.E.C.C. Packaged Processors
1
Processor
Core
Frequency
(MHz)
L2 Cache
Size
(KBs)
Processor
Power
2
(W)
Extended
Thermal
Plate Power
3
(W)
Min
T
PLATE
(°C)
Max
T
PLATE
(°C)
Min
T
COVER
(°C)
Max
T
COVER
(°C)
450 512 25.3 25.5 5 70 5 75
500 512 28.0 28.2 5 70 5 75