Datasheet

Datasheet 49
Thermal Specifications and Design Considerations
4.0 Thermal Specifications and Design Considerations
Limited quantities of Pentium III processors utilize S.E.C.C. package technology. This technology
uses an extended thermal plate for heatsink attachment. The extended thermal plate interface is
intended to provide accessibility for multiple types of thermal solutions. The majority of SC242-
based Pentium III processors use S.E.C.C.2 packaging technology. S.E.C.C.2 package technology
does not incorporate an extended thermal plate.
This chapter provides needed data for designing a thermal solution. However, for the correct
thermal measuring processes, refer to AP-905, Intel
®
Pentium
®
III Processor Thermal Design
Guidelines (Document Number 245087).
Figure 18 provides a 3-dimensional view of an S.E.C.C. package. This figure illustrates the thermal
plate location. Figure 19 provides a substrate view of an S.E.C.C.2 package.
Figure 18. S.E.C.Cartridge — 3-Dimensional View
Right Latch
Left Latch
Cover
Extended Thermal Plate