Datasheet

4 Datasheet
4.0 Thermal Specifications and Design Considerations.........................................................49
4.1 Thermal Specifications........................................................................................50
4.1.1 Thermal Diode........................................................................................ 53
5.0 S.E.C.C. and S.E.C.C.2 Mechanical Specifications.........................................................54
5.1 S.E.C.C. Mechanical Specifications....................................................................54
5.2 S.E.C.C.2 Mechanical Specification....................................................................61
5.3 S.E.C.C.2 Structural Mechanical Specification ...................................................67
5.4 Processor Package Materials Information ..........................................................69
5.5 Intel
®
Pentium
®
III Processor Signal Listing........................................................69
5.6 Intel
®
Pentium
®
III Processor Core Pad to Substrate Via Assignments..............76
5.6.1 Processor Core Pad Via Assignments (CPUID=067xh).........................76
5.6.2 Processor Core Signal Assignments (CPUID=067xh) ...........................76
5.6.3 Processor Core Pad Via Assignments (CPUID=068xh).........................87
6.0 Boxed Processor Specifications.......................................................................................88
6.1 Introduction .........................................................................................................88
6.2 Fan Heatsink Mechanical Specifications.............................................................88
6.2.1 Intel
®
Boxed Processor Fan Heatsink Dimensions ................................ 88
6.2.2 Intel
®
Boxed Processor Fan Heatsink Weight........................................90
6.2.3 Intel
®
Boxed Processor Retention Mechanism.......................................90
6.3 Fan Heatsink Electrical Requirements ................................................................ 91
6.3.1 Fan Heatsink Power Supply...................................................................91
6.4 Fan Heatsink Thermal Specifications..................................................................92
6.4.1 Intel
®
Boxed Processor Cooling Requirements......................................92
7.0 Intel
®
Pentium
®
III Processor Signal Description .............................................................93
7.1 Alphabetical Signals Reference ..........................................................................93
7.2 Signal Summaries .............................................................................................100