Datasheet

Pentium
®
III Xeon™ Processor at 500 and 550 MHz
4
Datasheet
4.3.3 Processor Information ROM and Scratch EEPROM Supported
SMBus Transactions ..............................................................................43
4.3.4 Thermal Sensor......................................................................................43
4.3.5 Thermal Sensor Supported SMBus Transactions..................................44
4.3.6 Thermal Sensor Registers......................................................................46
4.3.6.1 Thermal Reference Registers ...................................................46
4.3.6.2 Thermal Limit Registers ............................................................46
4.3.6.3 Status Register..........................................................................46
4.3.6.4 Configuration Register...............................................................47
4.3.6.5 Conversion Rate Register .........................................................47
4.3.7 SMBus Device Addressing.....................................................................48
5.0 Thermal Specifications and Design Considerations.........................................................49
5.1 Thermal Specifications........................................................................................50
5.1.1 Power Dissipation ..................................................................................50
5.1.2 Plate Flatness Specification ...................................................................51
5.2 Processor Thermal Analysis ...............................................................................51
5.2.1 Thermal Solution Performance...............................................................51
5.2.2 Thermal Plate to Heat Sink Interface Management Guide.....................52
5.2.3 Measurements for Thermal Specifications.............................................53
5.2.3.1 Thermal Plate Temperature Measurement ...............................53
5.2.3.2 Cover Temperature Measurement Guideline............................54
6.0 Mechanical Specifications................................................................................................55
6.1 Weight .................................................................................................................60
6.2 Cartridge to Connector Mating Details ................................................................60
6.3 Pentium
®
III Xeon™ Processor Substrate Edge Finger Signal Listing ...............62
7.0 Boxed Processor Specifications.......................................................................................71
7.1 Introduction .........................................................................................................71
7.2 Mechanical Specifications...................................................................................71
7.2.1 Boxed Processor Heatsink Dimensions .................................................73
7.2.2 Boxed Processor Heatsink Weight.........................................................73
7.2.3 Boxed Processor Retention Mechanism ................................................73
7.3 Thermal Specifications........................................................................................74
7.3.1 Boxed Processor Cooling Requirements ...............................................74
7.3.2 Optional Auxiliary Fan Attachment.........................................................74
7.3.2.1 Clearance Recommendations for Auxiliary Fan........................76
7.3.2.2 Fan Power Recommendations for Auxiliary Fan.......................77
7.3.2.3 Thermal Evaluation for Auxiliary Fan ........................................78
8.0 Integration Tools ..............................................................................................................78
8.1 In-Target Probe (ITP) for Pentium
®
III Xeon™ Processors.................................78
8.1.1 Primary Function ....................................................................................79
8.1.2 Debug Port Connector Description.........................................................79
8.1.3 Debug Port Signal Descriptions .............................................................80
8.1.4 Debug Port Signal Notes........................................................................82
8.1.4.1 General Signal Quality Notes ....................................................83
8.1.4.2 Signal Note: DBRESET#...........................................................83
8.1.4.3 Signal Note: TDO and TDI ........................................................83
8.1.4.4 Signal Note: TCK.......................................................................83
8.1.5 Using Boundary Scan to Communicate to the Processor ......................85