Intel Pentium M Processor with 2-MB L2 Cache and 533-MHz Front Side Bus Datasheet

Datasheet 27
Package Mechanical Specifications and Pin Information
4 Package Mechanical
Specifications and Pin Information
The Pentium M Processor will be available in 478 pin Micro-FCPGA and 479 ball Micro-FCBGA
packages. The Pentium M Processors 780, 770, 760, 750, 740 and 730 will also be available in a
lead free SLI (second level interconnect) version of the Micro-FCBGA package. Package
specifications are the same for all Micro-FCBGA packages. Different views of the Micro-FCPGA
package are shown in Figure 4-1 through Figure 4-3. Package dimensions are shown in Table 4-1.
Different views of the Micro-FCBGA package are shown in Figure 4-4 through Figure 4-6.
Package dimensions are shown in Table 4-7.
The Micro-FCBGA may have capacitors placed in the area surrounding the die. Because the die-
side capacitors are electrically conductive, and only slightly shorter than the die height, care should
be taken to avoid contacting the capacitors with electrically conductive materials. Doing so may
short the capacitors, and possibly damage the device or render it inactive. The use of an insulating
material between the capacitors and any thermal solution should be considered to prevent capacitor
shorting.
NOTE: All dimensions in millimeters. Values shown for reference only. Refer to Table 4-1 for details.
Figure 4-1. Micro-FCPGA Package Top and Bottom Isometric Views
TOP VIEW BOTTOM VIEW
LABEL
PACKAGE KEEPOUT
DIE
CAPACITOR AREA