Intel Pentium M Processor Datasheet

Intel
®
Pentium
®
M Processor Datasheet 39
Package Mechanical Specifications and Pin Information
4 Package Mechanical
Specifications and Pin Information
The Intel Pentium M processor is available in 478-pin, Micro-FCPGA and 479-ball, Micro-
FCBGA packages. The Low Voltage and Ultra Low Voltage Intel Pentium M processors are
available only in the Micro-FCBGA package. Different views of the Micro-FCPGA package are
shown in Figure 4 through Figure 6. Package dimensions are shown in Table 18. Different views of
the Micro-FCBGA package are shown in Figure 8 through Figure 10. Package dimensions are
shown in Table 19. The Intel Pentium M Processor Die Offset is illustrated in Figure 7.
The Micro-FCBGA may have capacitors placed in the area surrounding the die. Because the die-
side capacitors are electrically conductive, and only slightly shorter than the die height, care should
be taken to avoid contacting the capacitors with electrically conductive materials. Doing so may
short the capacitors, and possibly damage the device or render it inactive. The use of an insulating
material between the capacitors and any thermal solution is recommended to prevent capacitor
shorting.
Figure 4. Micro-FCPGA Package Top and Bottom Isometric Views
NOTE: All dimensions in millimeters. Values shown for reference only. Refer to Tabl e 18 for details.
TOP VIEW BOTTOM VIEW
LABEL
PACKAGE KEEPOUT
DIE
CAPACITOR AREA