FIPS Standard
4.5.3 Multiple-Chip Embedded Cryptographic Modules
In addition to the general security requirements specified in Section 4.5.1, the following requirements are
specific to multiple-chip embedded cryptographic modules.
SECURITY LEVEL 1
The following requirement shall apply to multiple-chip embedded cryptographic modules for Security
Level 1.
• If the cryptographic module is contained within an enclosure or removable cover, a production-
grade enclosure or removable cover shall be used.
SECURITY LEVEL 2
In addition to the requirement for Security Level 1, the following requirements shall apply to multiple-chip
embedded cryptographic modules for Security Level 2.
Either
• the cryptographic module components shall be covered with a tamper-evident coating or potting
material (e.g., etch-resistant coating or bleeding paint) or contained in a tamper-evident enclosure to
deter direct observation, probing, or manipulation of module components and to provide evidence
of attempts to tamper with or remove module components, and
• the tamper-evident coating or tamper-evident enclosure shall be opaque within the visible spectrum,
or
• the cryptographic module shall be entirely contained within a metal or hard plastic production-grade
enclosure that may include doors or removable covers,
• the enclosure shall be opaque within the visible spectrum, and
• if the enclosure includes any doors or removable covers, then the doors or covers shall be locked
with pick-resistant mechanical locks employing physical or logical keys or shall be protected with
tamper-evident seals (e.g., evidence tape or holographic seals).
SECURITY LEVEL 3
In addition to the requirements for Security Levels 1 and 2, the following requirements shall apply to
multiple-chip embedded cryptographic modules for Security Level 3.
Either
• the multiple-chip embodiment of the circuitry within the cryptographic module shall be covered
with a hard coating or potting material (e.g., a hard epoxy material) that is opaque within the visible
spectrum
or
• the applicable Security Level 3 requirements for multiple-chip standalone cryptographic modules
shall apply. (Section 4.5.4)
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