Guidelines

Quality and Reliability Requirements
52 Dual-Core Intel
®
Xeon
®
Processor 7000 Sequence Thermal /Mechanical Guidelines
C.1.2.3 Shock Test Procedure
Recommended performance requirement for a baseboard:
• Quantity: 3 drops for + and – directions in each of 3 perpendicular axes (i.e. total 18 drops).
• Profile: 50 G trapezoidal waveform, 11 ms duration, 4.32 m/sec minimum velocity change.
• Setup: Mount sample board on test fixture.
C.1.2.4 Recommended Test Sequence
Each test sequence should start with components (i.e. baseboard, heatsink assembly, etc.) that have
not been previously submitted to any reliability testing.
The test sequence should always start with a visual inspection after assembly, and BIOS/Processor/
memory test. The stress test should be then followed by a visual inspection and then BIOS/
Processor/memory test.
C.1.2.5 Post-Test Pass Criteria
The post-test pass criteria are:
1. No significant physical damage to the heatsink and retention hardware.
2. Heatsink remains seated and its bottom remains mated flatly against the IHS surface. No
visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with
respect to the retention hardware.
3. No signs of physical damage on baseboard surface due to impact of heatsink.
4. No visible physical damage to the processor package.
5. Successful BIOS/Processor/memory test of post-test samples.
6. Thermal compliance testing to demonstrate that the case temperature specification can be met.
Figure C-2. Shock Acceleration Curve
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Time (Milliseconds
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