Guidelines

Dual-Core Intel
®
Xeon
®
Processor 7000 Sequence Thermal /Mechanical Guidelines 31
Thermal Mechanical Design
2.4.6 Thermal Profile Adherence
The 2U+ CEK Intel reference thermal solution is designed to meet the Thermal Profile for the
Dual-Core Intel Xeon processor 7000 sequence. From Table 2-3, the three-sigma (mean+3sigma)
performance of the thermal solution is computed to be 0.215 °C/W and the processor local ambient
temperature (T
LA
) for this thermal solution is 40 °C. The Thermal Profile equation for this thermal
solution is calculated as:
Equation 2-8. y = 0.215x + 45
where,
y = Processor T
CASE
value (°C)
x = Processor power value (W)
Figure 2-12 below shows the comparison of this reference thermal solution’s Thermal Profile to the
Dual-Core Intel Xeon processor 7000 sequence Thermal Profile specification. The 2U+ CEK
solution meets the Thermal Profile A with a 4.1 °C margin at the lower end (Pcontrol_base) and a
0.1 °C margin at the upper end (TDP). By designing to Thermal Profile, it is ensured that no
measurable performance loss due to TCC activation is observed under the given environmental
conditions.
Figure 2-12. 2U+ CEK Thermal Adherence to Dual-Core Intel® Xeon® Processor
7000 Sequence Thermal Profile
0
10
20
30
40
50
60
70
80
0 25 50 75 100 125 150 175
Power (W)
CEK Reference Solution
T
case
= 0.215 x Power + 40
T
casemax@TDP
TDP
T
casemax@
P
control base
Thermal Profile
T
casemax
= 0.185 x Power + 45