Guidelines

Thermal Mechanical Design
28 Dual-Core Intel
®
Xeon
®
Processor 7000 Sequence Thermal /Mechanical Guidelines
2.4.4.2 Assembly Drawing
The CEK reference thermal solution is designed to extend air-cooling capability through the use of
larger heatsinks with minimal airflow blockage and bypass. CEK retention solution can allow the
use of much heavier heatsink masses compared to the legacy limits by using a load path directly
attached to the chassis pan. The CEK spring on the secondary side of the baseboard provides the
necessary compressive load for the thermal interface material. The baseboard is intended to be
isolated such that the dynamic loads from the heatsink are transferred to the chassis pan via the stiff
screws and standoffs. This reduces the risk of package pullout and solder-joint failures.
Figure 2-10. Exploded View of CEK Thermal Solution Components