Guide

Quality and Reliability Requirements
70 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
Note: Need to pass customer visual, thermal, mechanical, and electrical requirements.
B.1.1 Customer Environmental Reliability Testing
The conditions of the tests outlined here may differ from the customers’ system
requirements. Board/system level requirements are to be identified and performed by
customers planning on using Intel reference thermal/mechanical solution.
B.1.2 Socket Durability Test
The socket must withstand 30 mating cycles. Test per EIA-364, test procedure 09.
Measure contact resistance when mated in 1st and 30th cycles. The package must be
removed at the end of each de-actuation cycle and reinserted into the socket.
B.2 Ecological Requirement
General requirements: Materials used in this product must comply with customers’
Environmental Product Content Specification. Intel’s is available at:
<http://supplier2.intel.com/EHS/Environmental_Product_Content_Specification_9-16-
03.doc>
Material shall be resistant to fungal growth. Examples of non-resistant materials
include cellulose materials, animal- and vegetable-based adhesives, grease, oils, and
many hydrocarbons. Synthetic materials such as PVC formulations, certain
polyurethane compositions (for example, polyester and some polyethers), plastics
which contain organic fillers of laminating materials, paints, and varnishes also are
susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-
STD-810E, Method 508.4 must be performed to determine material performance.
Material used shall not have deformation or degradation in a temperature life test.
Table B-1. Typical Stress Tests
Stress Test Example Test Description Purpose/Failure Mechanism
Temperature Cycle
IPC 9701 or
-40C to 85°C
Solder joint fatigue, via barrel
cracking, and TIM separation/disbond
under thermo-mechanical stresses
Temperature/Humidity
(unbiased)
85% RH/85°C
Corrosion and material migration
induced by moisture/temperature
Bake 125°C
Creep induced failure mechanisms, for
example contact relaxation, solder
ball creep, and thermal TIM
degradation
Mechanical Shock
System level unpackaged test
2 drops for + and - directions in each of 3
perpendicular axes (that is, total 12 drops).
Profile: 25g, Trapezoidal waveform, velocity
change depending on system weight
Mechanical induced brittle solder joint
failures and TIM separation/disbond
Random Vibration
System-level unpackaged test
Duration: 10 min/axis, 3 axes
Frequency Range: .001 g2/Hz @ 5Hz,
ramping to .01 g2/Hz @20 Hz, .01 g2/Hz @
20 Hz to 500 Hz
Power Spectral Density (PSD) Profile:
2.20 g RMS
Example mechanisms include cyclic
mechanical fatigue stress and TIM
separation disbond