Guide

Thermal and Mechanical Design
18 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
Solder balls enable the socket to be surface mounted to the processor board. Each
contact will have a corresponding solder ball. Solder ball position may be at an offset
with respect to the contact tip and base. Hexagonal area array ball-out increases
contact density by 12% while maintaining 40 mil minimum via pitch requirements.
The socket interfaces with the package (processor) and the Independent Loading
Mechanism (ILM). The ILM design includes a back plate which is integral to having a
uniform load on the socket solder joints.
The socket cover is intended to be reusable and recyclable. It will enable socket pick
and placing during motherboard assembly. The socket cover will also protect the socket
contacts from contamination and damage during board assembly and handling.
Features of the socket includes:
• Contact housing
• Processor package keying (4x)
• Package seating plane
• ILM keying (1x)
• side walls for package alignment (8x)
• Finger access for ease of package insertion and removal
• Center cavity for the processor secondary side and motherboard primary
side components
Figure 2-6. Hexagonal Array in LGA2011-1
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