Guide

Mechanical Drawings
112 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
Figure G-21. Processor Heatsink Retaining Ring Mechanical Drawing - E75155 Rev C
13
4
5678
B C D
A
123
4
5678
B C D
A
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
R
5
3.20
0 -0.12
0.126
+0.000 -0.004
[]
50.60#0.04
0.0236#0.0015[]
MAX.5.20#0.10
0.205#0.003[]
4X R MIN.0.50
0.020[]
57.00 #0.20
0.276#0.007[]
5
2.80#0.30
0.110#0.011[]
E75155 1 C
DWG. NO SHT. REV
SHEET 1 OF 1DO NOT SCALE DRAWINGSCALE: 1
CE75155D
REVDRAWING NUMBERSIZE
ROMLEY HS RETAINING RING
TITLE
EASD / PTMI
DEPARTMENT
SEE NOTESSEE NOTES
FINISHMATERIAL DATEAPPROVED BY 06/19/09C. HO DATECHECKED BY 06/19/09N. ULEN DATEDRAWN BY 06/19/09N. ULEN DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5-1994 DIMENSIONS ARE IN MILLIMETERS TOLERANCES: .X # .5 Angles # 1.0 $ .XX # 0.25 .XXX # 0.127
THIRD ANGLE PROJECTION
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPROVED
- A RELEASE FOR THERMAL TARGET SPECIFICATION 06/19/09 -
C5 B6 C5 B4
B O.D. TOLERANCE +/-0.10 TO +/-0.20
SNAP DIAMETER 3.175 TO 3.20, PLUS TOLS I.D. 5.18 TO 5.20 THICKNESS 0.64 +/-.05 TO 0.60 +/- .04
07/07/09
C6
NOTE 6 NOTE 5
C ADDED RING GAP DIMENSION 2.8 +/- 0.3
ADDED NOTE 6 FOR OFF THE SHELF COMPLIANCE MODIFIED NOTE 5 TO INDICATE CTF MEASUREMENTS BE TAKEN AFTER ONE (1) INSTALLATION
11/18/09
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
NOTES: 1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE. 2. PRIMARY DIMENSIONS STATED IN MILLIMETERS. [BRACKETED] DIMENSIONS STATED IN INCHES. 3. MATERIAL: SPRING STEEL OR STAINLESS STEEL YIELD STRENGTH >= 90000 PSI (620 MPA) 5 MODULUS OF ELASTICITY >= 28000 KSI (193 GPA) 5 MATERIAL PROPERTIES MUST BE MET AFTER FINAL E-RING MANUFACTURING PROCESS 4. FINISH: NI PLATED IF NOT STAINLESS
5 CRITICAL TO FUNCTION DIMENSION
CTF DIMENSIONS SHOULD BE VERIFIED AFTER ONE (1) INSTALLATION AND REMOVAL FROM THE GROOVE GEOMETRY SPECIFIED IN DRAWING E86111. 6. E-RING SPECIFICATION JIS B 2805 APPLIES FOR OFF THE SHELF COMPONENT COMPLIANCE.