Guidelines

Intel
®
7500 Chipset Thermal Mechanical Design Guide 25
Reference Thermal Solution
6.3 Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or
implementation requirements, the height, width, and depth constraints typically placed
on the Intel 7500 chipset thermal solution are shown in Figure 6-2.
When using heatsinks that extend beyond the IOH reference heatsink envelope shown
in Figure 6-2, any motherboard components placed between the heatsink and
motherboard cannot exceed 1.60 mm (0.063 in.) in height.
Note: All Heights shown above are nominal values and post SMT.
6.4 Board-Level Components Keepout Dimensions
The location of hole patterns and keepout zones for the reference thermal solution are
shown in Figure 6-3.
Figure 6-2. Tall Torsional Clip Heatsink Volumetric Envelope for the IOH
TNB
Heatsink
50.00 mm.
IOH
Tall
Heatsink
Die
FCBGA + Solder Balls
Motherboard
IOH
Tall
Heatsink
TIM