Datasheet

Mechanical Specifications

Dual-Core Intel

Xeon

Processor 7000 Series Datasheet 37

3.4 Package Handling Guidelines

Table 3-2 includes a list of guidelines on package handling in terms of recommended maximum

loading on the processor IHS relative to a fixed substrate. These package handling loads may be

experienced during heatsink removal.

3.5 Package Insertion Specifications

The Dual-Core Intel Xeon processor 7000 series can be inserted into and removed from a

mPGA604 socket 15 times. The socket should meet the mPGA604 requirements detailed in the

mPGA604 Socket Design Guidelines.

3.6 Processor Mass Specifications

The typical mass of the Dual-Core Intel Xeon processor 7000 series is 0.0784 lb [1.2544 oz]

(35.5616 g) to 0.0788 lb [1.2608 oz] (35.743 g). This mass [weight] includes all the components

that are included in the package.

3.7 Processor Materials

Table 3-3 lists some of the package components and associated materials.

Table 3-2. Package Handling Guidelines

Parameter Maximum Recommended Notes

Shear 356 N [80 lbf]

NOTES:

1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.

2. These guidelines are based on limited testing for design characterization.

Tensile 156 N [35 lbf]

3. A tensile load is defined as a pulling load applied to the IHS in the direction normal to the IHS surface.

Torque 8 N-m [70 lbf-in]

4. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface.

Table 3-3. Processor Materials

Component Material

Integrated Heat Spreader (IHS) Nickel Plated Copper

Substrate Fiber-Reinforced Resin

Substrate Pins Gold Plated Copper