Vol 1

Intel® Xeon® Product 2800/4800/8800 v2 Product Family 43
Datasheet Volume One, February 2014
Thermal Management Specifications
4 Thermal Management
Specifications
4.1 Package Thermal Specifications
The Intel® Xeon® E7v2 processor requires a thermal solution to maintain
temperatures within operating limits. Any attempt to operate the processor outside
these limits may result in permanent damage to the processor and potentially other
components within the system, see section Section 6.7.1, “Storage Conditions
Specifications”. Maintaining the proper thermal environment is key to reliable, long-
term system operation.
A complete solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
This section provides data necessary for developing a complete thermal solution. For
more information on designing a component level thermal solution, refer to the Intel®
Xeon® Product 2800/4800/8800 v2 Product FamilyIntel® Xeon® Product
2800/4800/8800 v2 Product Family Thermal/Mechanical Design Guide.
4.1.1 Thermal Specifications
To allow optimal operation and long-term reliability of Intel processor-based systems,
the processor must remain within the minimum and maximum case temperature
(T
CASE
) specifications as defined by the applicable thermal profile. Thermal solutions
not designed to provide sufficient thermal capability may affect the long-term reliability
of the processor and system. For more details on thermal solution design, please refer
to the Intel® Xeon® Product 2800/4800/8800 v2 Product FamilyIntel® Xeon® Product
2800/4800/8800 v2 Product Family Thermal/Mechanical Design Guide.
The Intel® Xeon® E7v2 processors implement a methodology for managing processor
temperatures which is intended to support acoustic noise reduction through fan speed
control and to assure processor reliability. Selection of the appropriate fan speed is
based on the relative temperature data reported by the processor’s Platform
Environment Control Interface (PECI).
If the DTS value is less than T
CONTROL
, then the case temperature is permitted to
exceed the Thermal Profile, but the DTS value must remain at or below TCONTROL.
For T
CASE
implementations, if DTS is greater than TCONTROL, then the case
temperature must meet the T
CASE
based Thermal Profiles.
For DTS implementations:
•T
CASE
thermal profile can be ignored during processor run time.
• If DTS is greater than Tcontrol then follow DTS thermal profile specifications for fan
speed optimization.