Guidelines

Introduction
8 Dual-Core Intel
®
Xeon
®
Processor 7000 Sequence Thermal /Mechanical Guidelines
NOTE: Contact your Intel field sales representative for the latest revision and order number of this document.
1.4 Definition of Terms
Thin Electronics Bay Specification (A Server System Infrastructure (SSI)
Specification for Thin Servers
www.ssiforum.com
European Blue Angel Recycling Standards http://www.blauer-engel.de
Table 1-1. References (Sheet 2 of 2)
Document Comment
Table 1-2. Terms and Definitions (Sheet 1 of 2)
Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
FMB Flexible Motherboard Guideline: an estimate of the maximum value of a processor
specification over certain time periods. System designers should meet the FMB values
to ensure their systems are compatible with future processor releases.
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
mPGA604 The surface mount Zero Insertion Force (ZIF) socket designed to accept the Dual-Core
Intel® Xeon® Processor 7000 Sequence.
P
MAX
The maximum power dissipated by a semiconductor component.
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
CASE
– T
LA
) / Total
Package Power. Heat source should always be specified for measurements.
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
CASE
– T
S
) / Total
Package Power.
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
LA
) / Total Package Power.
T
CASE
The case temperature of the processor, measured at the geometric center of the
topside of the IHS.
T
CASE
_
MAX
The maximum case temperature as specified in a component specification.
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation when the die temperature is very near its operating limits.
T
CONTROL
A processor unique value, which defines the lower end of the thermal profile and is
targeted to be used in fan speed control mechanisms.
Offset A value programmed into each processor during manufacturing that can be obtained by
reading IA_32_TEMPERATURE_TARGET MSR. This is a static and a unique value.
Refer to Prescott, Nocona, and Potomac Processor BIOS Writer’s Guide for further
details.
TDP Thermal Design Power: Thermal solution should be designed to dissipate this target
power level. TDP is not the maximum power that the processor/chipset can dissipate.
Thermal Monitor A feature on the processor that can keep the processor’s die temperature within factory
specifications under nearly all conditions.