Guide

Thermal and Mechanical Design
28 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
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2.1.3 Mechanical Considerations
An retention/loading mechanism must be designed to support the processor heatsink
and to ensure processor interface with the socket contact is maintained since there are
no features on the LGA2011-1 socket for direct attachment of the heatsink or retaining
the processor. In addition to supporting the processor heatsink over the processor, this
mechanism plays a significant role in the robustness of the system in which it is
implemented, in particular:
• Ensuring that thermal performance of the TIM applied between the IHS and the
heatsink is achievable. TIMs, especially those based on phase change materials,
are very sensitive to applied pressure: the higher the pressure, the better the initial
performance. TIMs such as thermal greases are not as sensitive to applied
pressure. Refer to Section 2.2.6, Section 2.4.3 for information on trade-offs made
with TIM selection. Designs should consider the impact of shock and vibration
events on TIM performance as well as possible decrease in applied pressure over
time due to potential structural relaxation in enabled components.
• Ensuring that system electrical, thermal, and structural integrity is maintained
under shock and vibration events. The mechanical requirements of the attach
mechanism depend on the weight of the heatsink, as well as the level of shock and
vibration that the system must support. The overall structural design of the
Figure 2-13. LGA2011 Socket NCTF Solder Joints (Bottom View)