Guide

Thermal and Mechanical Design
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 27
Thermal/ Mechanical Specifications and Design Guide
2.1.2.4.10 Solder Ball Characteristics
• Number of Solder Balls
Total number of solder balls: 2011.
• Layout
The solder balls are laid out in two ‘L’ shape regions, as shown in Appendix F.
•Material
Lead free SAC solder alloy with a silver content between 3% and 4% with a melting
point temperature of 217 C maximum (for example, SnAgCu) and be compatible with
standard lead free processing such as Immersions silver (ImAg) and OSP MB surface
finish with SnAg/SnAgCu solder paste.
The co-planarity (profile) and true position requirements are defined in Appendix F.
• Co-Planarity
The co-planarity (profile) requirement for all solder balls on the underside of the socket
is defined in Appendix F.
• True Position
The solder ball pattern has a true position requirement with respect to applicable
datum in order to mate with the motherboard land pattern. Refer to Appendix F
for details.
2.1.2.5 LGA2011 Socket NCTF Solder Joints
Intel has defined selected 43 solder joints of the socket as non-critical to function
(NCTF) when evaluating package solder joints post environmental testing. NCTF solder
joints are located at four corners, 10 contacts in NE corner and 11 contacts per all other
corners, as shown in Figure 2-13.The signals at NCTF locations are typically redundant
ground or non-critical reserved, so the loss of the solder joint continuity at end of life
conditions will not affect the overall product functionality.